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參數(shù)資料
| 型號： | CDR02BP101BDSM |
| 廠商： | KEMET Corporation |
| 元件分類： | 電容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件頁數(shù)： | 6/10頁 |
| 文件大?。?/td> | 949K |
| 代理商： | CDR02BP101BDSM |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape
fed
automatic
pick
and
place
systems. See page
7
8
for details on reeling quantities for commercial chips
and page
87
for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape
fed
automatic
pick
and
place
systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
8mm
±
.30
(.315
±
.012")
or
12mm
±
.30
(.472
±
.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
KEMET
X
C
G
Z
Y
Grid
placement
courtyard
"
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
Z
3.18
3.70
4.90
4.90
G
0.68
0.70
1.50
1.50
X
0.80
1.10
1.40
2.00
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
Wave Solder
Reflow Solder
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
0402
0603
0805
1206
1210
1812
1825
2220
2225
Dimension
Not Recommended
Not Recommended
#
$
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
93
P
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CDR02BP101BDSP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDSR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDUM | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDUP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDUR | CERAMIC CHIP/MIL-PRF-55681 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CDR02BP101BDSP | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDSR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDUM | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDUP | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR02BP101BDUR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
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