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參數(shù)資料
| 型號： | CD74HC173NSRG4 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State |
| 中文描述： | 高速CMOS邏輯四D型觸發(fā)器，三態(tài) |
| 文件頁數(shù)： | 11/20頁 |
| 文件大?。?/td> | 520K |
| 代理商： | CD74HC173NSRG4 |
Orderable Device
Status
(1)
Package
Type
TSSOP
Package
Drawing
PW
Pins Package
Qty
250
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD74HC173PWTG4
ACTIVE
16
Green (RoHS &
no Sb/Br)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173E
ACTIVE
PDIP
N
16
25
CU NIPDAU
N / A for Pkg Type
CD74HCT173EE4
ACTIVE
PDIP
N
16
25
CU NIPDAU
N / A for Pkg Type
CD74HCT173M
ACTIVE
SOIC
D
16
40
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173M96
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173M96E4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173M96G4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173ME4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173MG4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173MT
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173MTE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT173MTG4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Addendum-Page 2
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PDF描述 |
|---|---|
| CD74HC173NSR | High-Speed CMOS Logic Quad D-Type Flip-Flop, Three-State |
| CD74HC192PW | High-Speed CMOS Logic Presettable Synchronous 4-Bit Up/Down Counters |
| CD74HC194NSR | High-Speed CMOS Logic 4-Bit Bidirectional Universal Shift Register |
| CD74HC22106 | QMOS 8 x 8 x 1 Crosspoint Switches with Memory Control |
| CD74HC22106E | QMOS 8 x 8 x 1 Crosspoint Switches with Memory Control |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CD74HC173PW | 功能描述:觸發(fā)器 Hi-Spd CMOS Quad D-Type F-F RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| CD74HC173PWE4 | 功能描述:觸發(fā)器 Hi-Spd CMOS Quad D-Type F-F RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| CD74HC173PWG4 | 功能描述:觸發(fā)器 Hi Sp CMOS Logic Quad D-Type RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| CD74HC173PWR | 功能描述:觸發(fā)器 Tri-State Quad RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| CD74HC173PWRE4 | 功能描述:觸發(fā)器 Hi-Spd CMOS Quad D-Type F-F RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
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