參數(shù)資料
型號: CD74ACT283M96G4
廠商: Texas Instruments, Inc.
英文描述: 4-Bit Binary Fill Adder With Fast Carry
中文描述: 4位二進制加法器與快速填充卡里
文件頁數(shù): 6/12頁
文件大小: 409K
代理商: CD74ACT283M96G4
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
CDIP
CDIP
PDIP
Package
Drawing
J
J
N
Pins Package
Qty
1
1
25
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD54AC283F3A
CD54ACT283F3A
CD74AC283E
ACTIVE
ACTIVE
ACTIVE
16
16
16
TBD
TBD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
25
Pb-Free
(RoHS)
40
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
A42 SNPB
A42 SNPB
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
CD74AC283EE4
ACTIVE
PDIP
N
16
25
CU NIPDAU
N / A for Pkg Type
CD74AC283M
ACTIVE
SOIC
D
16
40
CU NIPDAU
Level-1-260C-UNLIM
CD74AC283M96
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74AC283M96E4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74AC283M96G4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74AC283ME4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74AC283MG4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT283E
ACTIVE
PDIP
N
16
CU NIPDAU
N / A for Pkg Type
CD74ACT283EE4
ACTIVE
PDIP
N
16
CU NIPDAU
N / A for Pkg Type
CD74ACT283M
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT283M96
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT283M96E4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT283M96G4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT283ME4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT283MG4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Addendum-Page 1
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