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CD4014BMS, CD4021BMS
Chip Dimensions and Pad Layouts
FIGURE 9.
TYPICAL POWER DISSIPATION AS A FUNCTION OF FREQUENCY
Typical Performance Characteristics
(Continued)
SUPPLY VOLTAGE
(VDD) = 15V
10V
10V
5V
AMBIENT TEMPERATURE (T
A
) = +25
o
C
CL = 50pF
CL = 15pF
10
2
4
6
8
10
2
2
4
6
8
10
3
2
4
6
8
10
4
2
4
6
1
2
4
6 8
10
2
4 6 8
10
2
2
4 6 8
10
3
2
4 6 8
10
4
2
4 6 8
CLOCK INPUT FREQUENCY (fCL) (kHz)
10
5
P
μ
W
10
5
METALLIZATION:
Thickness: 11k
14k
, AL.
10.4k - 15.6k
, Silane
PASSIVATION:
BOND PADS:
0.004 inches X 0.004 inches MIN
DIE THICKNESS:
0.0198 inches - 0.0218 inches
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10
-3
inch)