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參數(shù)資料
| 型號(hào)： | CBTU0808 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Dual lane PCI Express port multiplexer |
| 中文描述： | 雙通道PCI Express端口復(fù)用器 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 86K |
| 代理商： | CBTU0808 |
CBTU0808_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 2 June 2006
14 of 16
Philips Semiconductors
CBTU0808
Dual lane PCI Express port multiplexer
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Abbreviations
16. References
[1]
PCI Express Base Specification, Rev 1.1 —
Revision 1.1, March 2005.
17. Revision history
Table 11.
Acronym
CMOS
PCI
PCIe
DUT
ESD
HBM
PRR
MM
Abbreviations
Description
Complementary Metal Oxide Semiconductor
Peripheral Component Interconnect
PCI Express
Device Under Test
ElectroStatic Discharge
Human Body Model
Pulse Repetition Rate
Machine Model
Table 12.
Document ID
CBTU0808_1
Revision history
Release date
20060602
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CBTU0808EE/G | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual lane PCI Express port multiplexer |
| CBTU0808EE/G,518 | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 DUAL LN PCI EXPRESS RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| CBTU0808EE/G-T | 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 DUAL LN PCI EXPRESS PORT MUX RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray |
| CBTU4411_09 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:11-bit DDR2 SDRAM MUX/bus switch with 12 W ON resistance |
| CBTU4411EE | 功能描述:數(shù)字總線開關(guān) IC 10BIT DDR SDRAM MUX BUS SWITCH RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:24 傳播延遲時(shí)間:0.25 ns 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TSSOP-56 封裝:Reel |
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