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參數(shù)資料
| 型號(hào)： | CB1F-10S-1.5H-TEJL-PA |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | Memory Stick Connectors |
| 中文描述： | 記憶棒連接器 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大?。?/td> | 815K |
| 代理商： | CB1F-10S-1.5H-TEJL-PA |
10
100
0
150
200
300
50S
0S
100S
150S
200S
240
max.
220
Preheating
Soldering
Preheating : 150 30 to 90 sec.
Soldering : 235±5 10 sec. max.
220 min. 10 to 20 sec.
IR Reflow Conditions
<
Recommended Conditions
>
Reflow system
Solder
Test board
Metal mask thickness
: IR reflow
: Paste type 63 Sn/37 Pb (Flux content 9 wt%)
: Glass epoxy 60mm x 100mm x 1.6 mm
: 0.15 mm
Recommended temperature.
The temperature may be slightly changed according to the solder paste type and volume used.
I
Recommended Temperature Profile
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