
CAT3644
2007 Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
11
Doc. No. 5023, Rev. B
Unused LED Channels
For applications not requiring all the channels, it is
recommended the unused LED pins be tied directly to
V
OUT
(see Figure 4).
Figure 4. Application with 3 LEDs
Protection Mode
If an LED is disconnected, the driver senses that and
automatically ignores that channel. When all LEDs are
disconnected, the driver goes to 1x mode where the
output is equal to the input voltage.
As soon as the output exceeds about 6V, the driver
resets itself and reevaluate the mode.
If the die temperature exceeds +150°C, the driver will
enter a thermal protection shutdown mode. When the
device temperature drops by about 20°C, the device
will resume normal operation.
LED Selection
LEDs with forward voltages (V
F
) ranging from 1.3V to
4.3V may be used. Selecting LEDs with lower V
F
is
recommended in order to improve the efficiency by
keeping the driver in 1x mode longer as the battery
voltage decreases.
For example, if a white LED with a V
F
of 3.3V is
selected over one with V
F
of 3.5V, the driver will stay
in 1x mode for lower supply voltage of 0.2V. This
helps improve the efficiency and extends battery life.
External Components
The driver requires four external 1
μ
F ceramic capa-
citors for decoupling input, output, and for the charge
pump. Both capacitors type X5R and X7R are
recommended for the LED driver application. In all
charge pump modes, the input current ripple is kept
very low by design and an input bypass capacitor of
1
μ
F is sufficient.
In 1x mode, the device operates in linear mode and
does not introduce switching noise back onto the
supply.
Recommended Layout
In charge pump mode, the driver switches internally at
a high frequency. It is recommended to minimize trace
length to all four capacitors. A ground plane should
cover the area under the driver IC as well as the
bypass capacitors. Short connection to ground on
capacitors C
IN
and C
OUT
can be implemented with the
use of multiple via. A copper area matching the TQFN
exposed pad (TAB) must be connected to the ground
plane underneath. The use of multiple via improves
the package heat dissipation.
Figure 5. Recommended Layout
VIN
GND
Pin1
C2
C1
RSET
CIN
COUT
GND
GND
EN/DIM
GND
V
IN
LED2
LED3
LED1
LED4
RSET
EN/DIM
CAT3644
V
IN
V
OUT
1μF
1μF
C
IN
C1-
C1+
C2-
C2+
1μF
1μF
C
OUT
R
SET
ENABLE
DIMMING