參數(shù)資料
型號(hào): CAT3614HV2-T2
英文描述: 4-Channel 1-Wire LED Driver in 3x3mm Package
中文描述: 4通道的1 - Wire的LED 3x3mm的驅(qū)動(dòng)程序包
文件頁數(shù): 10/12頁
文件大?。?/td> 462K
代理商: CAT3614HV2-T2
CAT3614
Doc. No. 25095, Rev. 01
10
2006 Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
LED Current Setting
Figure 1 shows the timing diagram necessary at the
EN/DIM input for setting the LED currents.
The EN/DIM set up time requires the signal to be
held high for 10μs or longer to ensure the
initialization of the driver at power-up. Each
subsequent pulse on the EN/DIM (300ns to 200μs
pulse duration) steps down the LED current from full
scale of 31mA to zero with a 1mA resolution.
Consecutive pulses should be separated by 300ns
or longer. Pulsing beyond the 0mA level restores the
current level back to full scale and the cycle repeats.
Pulsing frequencies from 5kHz up to 1MHz can be
supported during dimming operations. When the
EN/DIM is held low for 1.5ms or more, the CAT3614
enters the shutdown mode and draws “zero” current.
For applications with three LEDs or less, any unused
LED pins should be tied to VOUT, as shown on
Figure 3.
Protection Mode
If an LED becomes open-circuit, the output voltage
VOUT is internally limited to about 5.5V. This is to
prevent the output pin from exceeding its absolute
maximum rating.
The driver enters a thermal shutdown mode as soon
as the die temperature exceeds about +165oC.
When the device temperature drops down by about
20oC, the device resumes normal operation.
External Components
The driver requires a total of four external 1μF
ceramic capacitors: two for decoupling input and
output, and two for the charge pump. Both capacitor
types X5R and X7R are recommended for the LED
driver application. In the 1.5x charge pump mode,
the input current ripple is kept very low by design,
and an input bypass capacitor of 1μF is sufficient. In
1x mode, the device operating in linear mode does
not introduce switching noise back onto the supply.
Recommended Layout
In 1.5x charge pump mode, the driver switches
internally at a high frequency of 1MHz. It is
recommended to minimize trace length to all four
capacitors. A ground plane should cover the area
under the driver IC as well as the bypass capacitors.
Short connection to ground on capacitors Cin and
Cout can be implemented with the use of multiple
vias. A copper area matching the TDFN exposed
pad (GND) must be connected to the ground plane
underneath. The use of multiple vias improves the
package heat dissipation.
Figure 3. Three LED Application
Figure 4. Single Flash LED Application
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