參數(shù)資料
型號： CA3273
廠商： INTERSIL CORP
元件分類： 外設(shè)及接口
英文描述： High-Side Driver
中文描述： 0.6 A BUF OR INV BASED PRPHL DRVR, PSIP3
封裝： MODIFIED TO-202, SIP-3
文件頁數(shù)： 2/4頁
文件大?。?/td> 24K
代理商： CA3273
3-4
Specifications CA3273
Absolute Maximum Ratings
Thermal Information
Fault Max, Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . 40V
Maximum Operating V
CC
:
At I
O
= 400mA (-40
o
C to +85
o
C Ambient) . . . . . . . . . . . . . . 16V
At I
O
= 600mA (-40
o
C to +25
o
C Ambient) . . . . . . . . . . . . . . 24V
Max. Positive Output Peak Pulse, V
SW
Open . . . . . . . . . .V
CC
+12V
Max. Operating Output Load Current . . . . . . . . . . . . . . . . . .600mA
Short Circuit Load Current, I
SC
. . . . . . . . . . . . . . . .Internal Limiting
Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -13V
Thermal Resistance
Plastic SIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . +70
o
C/W
Maximum Power Dissipation, P
D
At +25
o
C Ambient, T
A
(Note 1). . . . . . . . . . . . . . . . . . . . . . . 1.8W
Derate above +25
o
C (No Heat Sink) . . . . . . . . . . . . .14.3mW/
o
C
Maximum Junction Temperature, T
J
(Note 2) . . . . . . . . . . . . 150
o
C
Ambient Operating Temperature Range . . . . . . . . .-40
o
C to +85
o
C
Storage Temperature Range. . . . . . . . . . . . . . . . . .-40
o
C to +150
o
C
Lead Temperature (Soldering 10s max) . . . . . . . . . . . . . . . . +265
o
C
θ
JA
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Specifications
T
A
= -40
o
C to +85
o
C, Unless Otherwise Noted, See Block Diagram for Test Pin Reference
PARAMETERS
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range
V
CC
V
CC
Reference to V
SW
4
-
24
V
Saturation Voltage(V
CC
- V
O
)
V
SAT
I
O
= -400mA, V
SW
= 0V, V
CC
= 16V
-
-
0.5
V
Operating Load
R
L
V
SW
= 0V (Switch ON)
T
A
= +85
o
C, V
CC
= 16V
40
-
-
T
A
= +25
o
C,V
CC
= 24V
40
Over-Voltage Shutdown Threshold
V
CC(THD)
V
SW
= 0V, R
L
= 1k
, Increase V
CC,
(V
O
goes low)
25
33
40
V
Over-Current Limiting
I
O(LIM)
V
CC
=16V, V
SW
= 1V (Switch ON)
-
-
1.2
A
Over-Temperature Limiting
T
LIM
-
150
-
o
C
Control Current, Switch ON
I
SW
V
CC
=16V, V
SW
= 0V
I
O
= 0mA
-
-15
-
mA
I
O
= -400mA
-
-22
-
mA
Control Current, Max. Load,
Switch ON
V
CC
= 24V, V
SW
= 0V,
I
O
= -600mA
-
-33
-
mA
Max. Control Current,High and
Low V
CC
I
SW(MAX)
R
L
= 40
, V
SW
= 1V
V
CC
= 24V
-50
-
-
mA
V
CC
= 7V
-50
-
-
mA
Min. Control Current, No Load,
Switch OFF
I
SW(NL)
V
O
= Open, (Switch OFF)
V
CC
= 24V,V
SW
= 23V
-200
-
+50
μ
A
V
CC
= 7V, V
SW
= 6V
-200
-
+50
μ
A
Output Current Leakage
I
O(LEAK)
V
O
= 0V, V
CC
= 16V, (Switch OFF)
V
SW
=16V
-100
-
+100
μ
A
V
SW
=15V
-100
-
+100
μ
A
NOTES:
1. The calculation for dissipation and junction temperature rise due to dissipation is: P
D
= (V
CC
- V
O
)x I
O
+ V
CC
x I
SW
and
T
J
= T
A
+ P
D
x
θ
JA
where T
J
is device junction temperature, T
A
is ambient temperature and
θ
JA
is the junction-to-ambient
thermal resistance.
2. Thermal limiting occurs at +150
o
C on the chip.
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