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| 型號： | C93-2002-TL |
| 廠商： | ARIES ELECTRONICS INC |
| 元件分類： | 插座 |
| 英文描述： | DIP20, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 600K |
| 代理商： | C93-2002-TL |
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 FAX (215) 781-9845
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
FEATURES
Anti-wicking design on LO-PROfile sockets eliminates flux or solder contamination
Dual beam, edge-grip contacts provide high retention and positive contact
End-to-end and side-to-side stackable
GENERAL SPECIFICATIONS
BODY: black UL 94V-0 glass-filled Nylon 4/6
DUAL BEAM CONTACT: Phosphor Bronze 521
CONTACT PLATING: (overall 50μ [1.27μ] Ni per SAE AMS-QQN-290); Sn 200μ
[5.08μ] min. matte Sn per ASTM B545-97; Sn/Pb 100-150μ [2.54-3.81μ] min.
90/10 Sn/Pb per MIL-P-81728; Au 10μ [0.25μ] min. Au per MIL-G-45204 in
contact area and 100-150μ [2.54-3.81μ] min. 90/10 Sn/Pb per MIL-P-81728 on
Solder Tail
WAFER: Nomex, 0.005 [0.13] thick
CONTACT CURRENT RATING: 1 amp
CONTACT RESISTANCE: 20 mΩ initial
INSULATION RESISTANCE: 100 mΩ @ 500VDC per MIL-STD-1344, Method 3003.1
DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC
OPERATING TEMPERATURE: -67°F [-55°C] to [105°C] 221°F for
Sn: -67°F [-55°C] to 257°F [125°C] for Au
ACCEPTS LEADS: up to 0.011 x 0.018 ±0.003 [0.28 x 0.46
±0.08]
or 0.021 [0.53] dia., 0.070-0.135 [1.78-3.43] long
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.036 ±0.002 [0.91 ±0.05] dia.
12001
Rev. AA
Series C84/93 LO-PROfile
Dual Beam Edge-Grip Socket w/Solder Tails
No. of Pins
Dim “A”
Dim. “B”
Centers “C”
Dim. “D”
Dim. “E”
Dim. “F”
6
0.290 [7.37]
0.200 [5.08]
0.300 [7.62]
0.395 [10.03]
—
8
0.390 [9.91]
0.300 [7.62]
0.395 [10.03]
—
14
0.690 [17.53] 0.600 [15.24]
0.300 [7.62]
0.395 [10.03]
—
0.350 [8.89]
16
0.790 [20.07] 0.700 [17.78]
0.300 [7.62]
0.395 [10.03]
—
0.400 [10.16]
18
0.890 [22.61] 0.800 [20.32]
0.300 [7.62]
0.395 [10.03]
—
0.450 [11.43]
20
0.990 [25.15] 0.900 [22.86]
0.300 [7.62]
0.395 [10.03]
—
0.500 [12.70]
24
1.190 [30.23] 1.100 [27.94] 0.600 [15.24] 0.695 [17.65] 0.400 [10.16]
—
28
1.390 [35.31] 1.300 [33.02] 0.600 [15.24] 0.695 [17.65] 0.500 [12.70]
—
40
1.990 [50.55] 1.900 [48.26] 0.600 [15.24] 0.695 [17.65] 0.500 [12.70] 1.000 [25.40]
ORDERING INFORMATION
C XX-XX XX-TL
Socket Series
Pin Plating
93 = Au
84 = Sn
No. of Pins
(see Table)
Optional Plating Sn/Pb
02 = Nomex Wafer (std)
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE: Aries reserves the
right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
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| C9322-02 | 功能描述:IC 與器件插座 LO-PROFILE 22 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9324-02 | 功能描述:IC 與器件插座 LO-PROFILE 24 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9324-03 | 功能描述:IC 與器件插座 24P SOCKET GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9328-02 | 功能描述:IC 與器件插座 LO-PROFILE 28 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C9329 | 制造商:HAMAMATSU 制造商全稱:Hamamatsu Corporation 功能描述:Photosensor amplifier Digital output function, current-to-voltage conversion amplifier for amplifying very slight photocurrent with low noise |
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