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參數(shù)資料
| 型號(hào)： | C8214-04 |
| 廠商： | ARIES ELECTRONICS INC |
| 元件分類(lèi)： | 插座 |
| 英文描述： | DIP24, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 198K |
| 代理商： | C8214-04 |
Series C82/C92 Standard Dual Beam
Solder Tail Edge-Grip Sockets
Note: Aries specializes in custom design and production. In addition to the stan-
dard products shown on this page, special materials, platings, sizes, and configu-
rations can be furnished, depending on quantities. Aries reserves the right to
change product specifications without notice.
FEATURES:
Dual beam, edge-grip contacts provide high retention with
positive wiping action.
Removable cover provides lower profile.
Side-to-side stackable.
SPECIFICATIONS:
Body is black UL-94V-0 Glass-filled 4/6 Nylon.
Contact is Grade A spring-tempered Phosphor Bronze.
Contact plating: (all over 50
μ” [1.27μm] Nickel per SAE-AMS-
QQ-N-290)
Tin = 200
μ” [5.08μm] min Matte Tin per ASTM B545-97.
Tin/Lead = 50-150
μ” [1.27-3.81μm] min. 90/10 Tin/Lead per
MIL-P-81728.
Gold = 10
μ” [0.25μm] min. Gold per MIL-G-45204.
Contact current rating=1 Amp.
Contact resistance=20 mOhms initial.
Insulation resistance=100 MOhms @ 500 VDC per
MIL-STD-1344, method 3003.1.
Dielectric withstanding voltage=1000 VAC.
Operating temperature= -67°F to 221°F [-55°C to 105°C] Tin
= -67°F to 257°F [-55°C to 125°C] Gold
Solderability: MIL-STD-202, method 208 less heat aging.
Accepts leads up to .011 x .018 ± .003 [.28 x .46 ± .08] or .021
[.53] diameter.
Accepts leads .100-.200 [2.54-5.08] long with cover.
MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.036 ± .002 [.91 ± .05] dia.
All tolerances ± .005 [.13]
unless otherwise specified
CONTACT DETAIL
ORDERING INFORMATION
No. of Pins
Dim. “A”
Dim. “B ”
Centers “C”
Dim. “D ” (max)
Dim. “E ”
8
.465 [11.81]
.300 [7.62]
.400 [10.16]
---
14
.765 [19.43]
.600 [15.24]
.300 [7.62]
.400 [10.16]
.300 [7.62]
16
.865 [21.97]
.700 [17.78]
.300 [7.62]
.400 [10.16]
18
.965 [24.51]
.800 [20.32]
.300 [7.62]
.400 [10.16]
20
1.065 [27.05]
.900 [22.86]
.300 [7.62]
.400 [10.16]
22
1.180 [29.97]
1.000 [25.40]
.400 [10.16]
.500 [12.70]
24
1.280 [32.51]
1.100 [27.94]
.600 [15.24]
.700 [17.78]
.500 [12.70]
28
1.480 [37.59]
1.300 [33.02]
.600 [15.24]
.700 [17.78]
.500 [12.70]
36
1.880 [47.75]
1.700 [43.18]
.600 [15.24]
.700 [17.78]
.800 [20.32]
40
2.080 [52.83]
1.900 [48.26]
.600 [15.24]
.700 [17.78]
.800 [20.32]
Pin tails can be bent
over without breaking
for mounting on PCB
ALL DIMENSIONS: INCHES [MILLIMETERS]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
12002
REV.C
C XX XX - XX TL
Socket series
Pin plating:
82 = Tin
92 = Gold
No. of pins
(see table)
Plating option:
Tin/Lead
C82 series:
-04 = closed entry
-54 = open entry
C92 series:
-00 = closed entry
-50 = open entry
Frenchtown, NJ USA
TEL:
(908) 996-6841
FAX:
(908) 996-3891
http://www.arieselec.com info@arieselec.com
abc
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參數(shù)描述 |
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| C8214-54 | 功能描述:IC 與器件插座 STANDARD DUAL BEAM TIN 14 PINS OPEN ENT RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類(lèi)型:Solder 插座/封裝類(lèi)型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C8216-04 | 功能描述:IC 與器件插座 CONNECTOR RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類(lèi)型:Solder 插座/封裝類(lèi)型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C821654 | 制造商:Texas Instruments 功能描述:Connector, Dip Socket, 16 Pin, 300 Mil, PC Mount |
| C8216-54 | 功能描述:IC 與器件插座 STANDARD DUAL BEAM TIN 16 PINS OPEN ENT RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類(lèi)型:Solder 插座/封裝類(lèi)型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| C8218-04 | 功能描述:IC 與器件插座 STANDARD DUAL BEAM TIN 18 PINS RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類(lèi)型:Solder 插座/封裝類(lèi)型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
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