
Subject to change without notice.
www.cree.com
FEATURES
MegaBright LED Performance
460 & 470nm
MB-8 – 8.0 mW min.
MB-10 - 10.0 mW min.
MB-12 - 12.0 mW min.
MB-14 - 14.0 mW min.
MB-16 - 16.0 mW min (460 nm)
505 nm - 6.0 mW min.
527 nm - 5.0 mW min.
Single Wire Bond Structure
Class 2 ESD Rating
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APPLICATIONS
White LEDs
LCD Backlighting Units
Outdoor LED Video Displays
Automotive Dashboard Lighting
Traffic Signals
MegaBright
Generation II LEDs
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MB290-S
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Cree’s MB Generation II series of MegaBright LEDs combine highly efficient InGaN materials with Cree’s
proprietary GSiC substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a
geometrically enhanced vertical chip structure to maximize light extraction efficiency and require only a single wire
bond connection. Sorted die kits provide die sheets conveniently sorted into wavelength and radiant flux bins. Cree’s
MB series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V
ESD. These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive
lighting and white LEDs, yet can also be used in high-volume applications such as LCD backlighting. Cree’s MB series
chips are compatible with most radial and SMT LED assembly processes.
D
C
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MB290-S
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Top View
Bottom View
GSiC LED Chip
300 x 300 μm
SiC Substrate
h = 250 μm
Backside
Metallization
Gold Bond Pad
112 μm Diameter
Die Cross Section
Cathode (-)
Anode (+)
Mesa (junction)
250 x 250 μm
InGaN