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參數(shù)資料
| 型號(hào)： | C470EZ290-Sxx00 |
| 廠商： | Cree, Inc. |
| 英文描述： | Cree㈢ EZBright290⑩ LEDs |
| 中文描述： | 克里㈢EZBright290⑩發(fā)光二極管 |
| 文件頁(yè)數(shù)： | 2/6頁(yè) |
| 文件大?。?/td> | 395K |
| 代理商： | C470EZ290-SXX00 |
Copyright 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
Cree and the Cree logo are registered trademarks, and EZBright and EZ, EZ-7, EZ-10, EZ-18, EZ-21, EZ-24 and EZBright290 are
trademarks of Cree, Inc.
2
CPR3CQ
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
Maximum Ratings at T
A = 25°C
Notes &3
CxxxEZ290-Sxx00
DC Forward Current
50 mA
Peak Forward Current (1/10 duty cycle @ 1 kHz)
100 mA
LED Junction Temperature
125°C
Reverse Voltage
5 V
Operating Temperature Range
-40°C to +100°C
Storage Temperature Range
-40°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2
1000 V
Typical Electrical/Optical Characteristics at T
A = 25°C, If = 20 mA
Note 3
Part Number
Forward Voltage (V
f, V)
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
(
λ
D, nm)
Min.
Typ.
Max.
Typ.
C460EZ290-Sxx00
2.7
3.2
3.7
2
21
C470EZ290-Sxx00
2.7
3.2
3.7
2
22
C505EZ290-Sxx00
2.7
3.2
3.7
2
30
C527EZ290-Sxx00
2.7
3.2
3.7
2
35
Mechanical Specifications
CxxxEZ290-Sxx00
Description
Dimension
Tolerance
P-N Junction Area (μm)
250 x 250
± 25
Top Area (μm)
280 x 280
± 25
Bottom Area (μm)
280 x 280
± 25
Chip Thickness (μm)
100
± 15
Au Bond Pad Diameter (μm)
100
-15, +5
Au Bond Pad Thickness (μm)
3.0
± 1.0
Back Contact Metal Area (μm)
280 x 280
± 25
Notes:
Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000
epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die
but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of the T-1
3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing
temperature must not exceed 325°C (<5 seconds). See Cree EZBright Applications Note for assembly process information.
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown.
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 20 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by manufacturer in large quantities and are provided for information only. All
measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an
integrating sphere using Illuminance E.
Specifications are subject to change without notice.
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