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參數(shù)資料
| 型號(hào)： | C1411VPA |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 1A High-Speed MOSFET Drivers |
| 中文描述： | 1A條高速M(fèi)OSFET驅(qū)動(dòng)器 |
| 文件頁(yè)數(shù)： | 11/18頁(yè) |
| 文件大?。?/td> | 702K |
| 代理商： | C1411VPA |
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2006 Microchip Technology Inc.
DS21390D-page 11
TC1411/TC1411N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units
INCHES
*
NOM
8
MILLIMETERS
NOM
8
Dimension Limits
MIN
MAX
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
*
Controlling Parameter
§
Significant Characteristic
n
p
A
A2
A1
E
E1
D
L
c
B1
B
eB
α
β
.100
.155
.130
2.54
3.94
3.30
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
.170
.145
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
4.32
3.68
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
§
5
5
5
5
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
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