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參數(shù)資料
| 型號： | C1411NVUA |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | 1A High-Speed MOSFET Drivers |
| 中文描述： | 1A條高速MOSFET驅動器 |
| 文件頁數(shù)： | 10/18頁 |
| 文件大?。?/td> | 702K |
| 代理商： | C1411NVUA |
TC1411/TC1411N
DS21390D-page 10
2006 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
D
A
A1
L
c
α
A2
E1
E
p
B
n
1
2
φ
β
F
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
.037 REF
F
φ
Footprint (Reference)
Notes:
Revised 07-21-05
*
Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016
.024
.118 BSC
.118 BSC
.000
.030
.193 BSC
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0°
0.23
0.40
8°
MILLIMETERS
*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX
NOM
1.10
0.80
0.15
0.95
MAX
8
-
-
-
15°
5°
-
15°
5°
-
JEDEC Equivalent: MO-187
Drawing No. C04-111
0°
-
8°
5°
5°
-
-
15°
15°
-
-
-
-
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
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| C1411NVUA713 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1A High-Speed MOSFET Drivers |
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| C1411VOA713 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1A High-Speed MOSFET Drivers |
| C1411VPA | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1A High-Speed MOSFET Drivers |
| C1411VUA | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1A High-Speed MOSFET Drivers |
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