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      參數(shù)資料
      

      


      


      
型號(hào)：
C1210C473J2RAC

      

      
廠商：
KEMET Corporation

      

      
英文描述：
CERAMIC CHIP CAPACITORS

      

      
中文描述：
陶瓷芯片電容器

      

      
文件頁(yè)數(shù)：
1/4頁(yè)

      

      
文件大?。?/td>
82K

      

      
代理商：
C1210C473J2RAC


      

      

      

	
      
    
    

    
      
	
      KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
      49
      C
      KEMET
      CERAMIC CHIP CAPACITORS
      C 0805 C 103 K
      5 R
      A C*
      CERAMIC
      SIZE CODE
      SPECIFICATION
      C - Standard
      CAPACITANCE CODE
      Expressed in Picofarads (pF)
      First two digits represent significant figures.
      Third digit specifies number of zeros. (Use 9
      for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
      (Example: 2.2pF = 229 or 0.50 pF = 508)
      CAPACITANCE TOLERANCE
      B – ±0.10pF
      J – ±5%
      C – ±0.25pF
      K – ±10%
      D – ±0.5pF
      M – ±20%
      F – ±1%
      P – (GMV) – special order only
      G – ±2%
      Z – +80%, -20%
      L #
      W #
      WIDTH
      B
      S
      MOUNTING
      TECHNIQUE
      Solder Reflow
      LENGTH
      1.0 (.04) ± .05(.002)
      BANDWIDTH
      0.20 (0.008)-0.40 (0.016)
      MIN. SEPARATION
      0.3 (.012)
      0.5 (.02) ± .05 (.002)
      1.6 (.063) ± 0.15 (.006)
      0.8 (.032) ± 0.15 (.006)
      0.35 (.014) ±0.15 (.006)
      0.7 (.028)
      2.0 (.079) ± 0.2 (.008)
      1.25 (.049) ± 0.2 (.008)
      0.5 (.02) ±.25 (.010)
      0.75 (.030)
      Soldor
      3.2 (.126) ± 0.2 (.008)
      1.6 (.063) ± 0.2 (.008)
      0.5 (.02) ±.25 (.010)
      N/A
      Solder Reflow
      3.2 (.126) ± 0.2 (.008)
      2.5 (.098) ± 0.2 (.008)
      0.5 (.02) ±.25 (.010)
      N/A
      4.5 (.177) ± 0.3 (.012)
      3.2 (.126) ± 0.3 (.012)
      0.6 (.024) ±.35 (.014)
      N/A
      4.5 (.177) ± 0.3 (.012)
      6.4 (.252) ± 0.4 (.016)
      0.6 (.024) ±.35 (.014)
      N/A
      5.6 (.220) ± 0.4 (.016)
      5.0 (.197) ± 0.4 (.016)
      0.6 (.024) ±.35 (.014)
      N/A
      5.6 (.220) ± 0.4 (.016)
      6.3 (.248) ± 0.4 (.016)
      0.6 (.024) ±.35 (.014)
      N/A
      DIMENSIONS
      —
      MILLIMETERS AND (INCHES)
      CAPACITOR ORDERING INFORMATION
       C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
       10, 16, 25, 50, 100 and 200 Volts
       Standard End Metalization: Tin-plate over nickel
      barrier
       Available Capacitance Tolerances: ±0.10 pF; ±0.25
      pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
      +80%-20%
       Tape and reel packaging per EIA481-1. (See page
      61 for specific tape and reel information.) Bulk
      Cassette packaging (0402, 0603, 0805 only) per
      IEC60286-6 and EIAJ  7201.
      FEATURES
      CAPACITOR OUTLINE DRAWINGS
      END METALLIZATION
      C-Standard
      (Tin-plated nickel barrier)
      FAILURE RATE LEVEL
      A- Not Applicable
      TEMPERATURE CHARACTERISTIC
      Designated by Capacitance
      Change Over Temperature Range
      G – C0G (NP0) (±30 PPM/°C)
      R – X7R (±15%) (-55°C + 125°C)
      P– X5R (±15%) (-55°C + 85°C)
      U – Z5U (+22%, -56%) (+10°C + 85°C)
      V – Y5V (+22%, -82%) (-30°C + 85°C)
      VOLTAGE
      1 - 100V
      2 - 200V
      5 - 50V
      (14 digits - no spaces)
      3 - 25V
      4 - 16V
      8 - 10V
      9 - 6.3V
      W
      L
      T
      B
      S
      TIN PLATE
      NICKEL PLATE
      CONDUCTIVE
      METALLIZATION
      ELECTRODES
      * Part Number Example: C0805C103K5RAC
      *Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 65.)
      #Note: These thicknesses are EIA maximums. Most chips are considerably thinner. Consult factory for details. Also, some extended values may be slightly thicker than EIA maximums.
       For extended value 1210 case size 
      – solder reflow only.
      Solder
      Reflow
      METRIC
      SIZE CODE
      (Ref only)
      1005
      1608
      2012
      3216
      3225
      4532
      4564
      5650
      5664
      EIA
      SIZE CODE
      0402*
      0603*
      0805*
      1206*
      1210*
      1812
      1825*
      2220
      2225
      (Standard Chips - For
      Military see page 55)
      See pages
      48-52 for
      thickness
      dimensions.
      
    
      
    
    
      


      


      

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      相關(guān)代理商/技術(shù)參數(shù)
      		

      參數(shù)描述
      		

      
      

      
C1210C473J2RAC7800
 制造商:KEMET Corporation 功能描述:

      

      
C1210C473J2RACTU
功能描述:多層陶瓷電容器MLCC - SMD/SMT 200volts 47000pF X7R 5% RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel

      

      
C1210C473J3GAC
功能描述:多層陶瓷電容器MLCC - SMD/SMT RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel

      

      
C1210C473J3GAC7800
功能描述:多層陶瓷電容器MLCC - SMD/SMT .047UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel

      

      
C1210C473J3GACTU
功能描述:多層陶瓷電容器MLCC - SMD/SMT 25volts 47000pF 5% C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel

      

      
    
    
    
	
      	
    
    
     
     
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