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參數(shù)資料
F3281 5/07
Product Bulletin
Dimensions – Millimeters (Inches)
EIA Size
Code
Metric Size
Code
L
Length
W
Width
B
Bandwidth
S
Separation
0603
1608
1.6 (.063) ± 0.15 (.006)
0.8 (.032) ± 0.15 (.006)
0.35 (.014) ± 0.15 (.006)
0.70 (.028)
0805
2012
2.0 (.079) ± 0.20 (.008)
1.25 (.049) ± 0.20 (.008)
0.05 (.02) ± 0.25 (.010)
0.75 (.030)
1206
3216
3.2 (.126) ± 0.20 (.008)
1.6 (.063) ± 0.20 (.008)
0.50 (.02) ± .25 (.010)
N/A
1210
3225
3.2 (.126) ± 0.20 (.008)
2.5 (.098) ± 0.20 (.008)
0.50 (.02) ± .25 (.010)
N/A
Outline Drawing
Surface Mount Ceramic Chip Capacitors
/
FT-CAP
/
Flexible Terminations
See Capacitance Value Table next page for thickness dimension.
C
0603
X
224
K
3
R
A
C
Style
C - Ceramic
Size Code
See dimension table
Specification
X - Flexible Termination
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
Capacitance Tolerance
K = ±10%; M = ±20%; J = ±5%
Voltage
9 = 6.3V, 8 = 10V, 4 = 16V, 3 = 25V,
5 = 50V, 1 = 100V, 2 = 200V
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
End Metallization
C = Standard (Tin-plate)
Failure Rate Level
A = Not Applicable
Ordering Information
The FT-CAP is a surface mount multi-layer ceramic capacitor that incorporates a unique and flexible termi-
nation system. Integrated with KEMET's standard termination materials, a conductive epoxy is utilized
between the conductive metallization and nickel barrier finish in order to establish pliability while maintain-
ing terminal strength, solderability and electrical performance. This technology directs board flex stress away
from the ceramic body and into the termination area. As a result, this termination system mitigates the risk
of low-IR or short-circuit failures associated with board flex. The FT-CAP complements our current "Open
Mode" and "Flexible Electrode (FE-CAP)" products by providing our customers with a complete portfolio of
flex solutions.
Tin Plate
Nickel Plate
Silver Epoxy
Conductive Metallization
Electrodes
T
W
S
L
B
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| C1206X471M3RAC | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations |
| C1206X471M4RAC | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations |
| C1206X471M5RAC | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations |
| C1206X471M8RAC | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations |
| C1206X471M9RAC | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| C1206X472J1RAL7210 | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 100Volts 4700pF 5% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel |
| C1206X472J1RALTU | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 100Volts 4700pF 5% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel |
| C1206X472J2RAL7210 | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 200Volts 4700pF 5% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel |
| C1206X472J2RALTU | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 200Volts 4700pF 5% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel |
| C1206X472J3RAL7210 | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 25Volts 4700pF 5% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel |
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