參數(shù)資料
型號: C106
廠商: Motorola, Inc.
英文描述: 8X100 OHM 2% ISOLATED RES NETWORK DIP-16
中文描述: 可控硅4安培RMS的50到600伏特
文件頁數(shù): 5/6頁
文件大小: 62K
代理商: C106
C106 Series
http://onsemi.com
5
The dimensional diagrams below compare the critical dimensions of the ON Semiconductor C-106 package with
competitive devices. It has been demonstrated that the smaller dimensions of the ON Semiconductor package make it
compatible in most lead-mount and chassis-mount applications. The user is advised to compare all critical dimensions for
mounting compatibility.
ON Semiconductor C-106 Package
Competitive C-106 Package
.315
____
.285
.105
____
.095
.054
____
.046
.420
____
.400
.400
____
.360
.385
.365
.135
.115
.520
.480
.127
____
.123
DIA
.105
.095
.190
.170
.026
____
.019
.025
.035
.295
____
.305
.148
____
.158
.115
____
.130
.015
.025
.050
____
.095
.145
.155
5 TYP
.425
____
.435
.575
____
.655
.020
____
.026
1 2 3
.045
____
.055
.095
____
.105
.040
.094 BSC
PACKAGE INTERCHANGEABILITY
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