參數(shù)資料
型號(hào): C0603C153C2GC
廠商: KEMET Corporation
英文描述: CERAMIC CHIP CAPACITORS
中文描述: 陶瓷芯片電容器
文件頁數(shù): 7/8頁
文件大?。?/td> 1023K
代理商: C0603C153C2GC
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20
°
20
°
Maximum
Typical
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm
and
12mm
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
1.75
±
0.10
(.069
±
0.004)
4.0
±
0.10
(.157
±
0.004)
2.0
±
0.05
(.079
±
0.002)
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
Table 1
Tape
Size
D
0
P
0
E
P
2
T
1
G
1
G
2
R Min.
8mm
1/2
Pitch
2.0
±
0.10
(.079
±
.004)
See Require-
ments
Section 3.3 (d)
4.0
±
0.10
(0.157
±
.004)
3.5
±
0.05
(.138
±
.002)
8.0
±
0.3
(.315
±
0.012)
See Note 1
Table 1
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
Compositions.
See Note 3.
Tape
Size
P
1
W
F
A
0
B
0
T
8mm
12mm
4.0
±
0.10
(0.157
±
.004)
8.0
±
0.10
(0.315
±
.004)
12mm
Double
Pitch
12.0
±
0.3
(.472
±
.012)
5.5
±
0.05
(.217
±
.002)
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
Sketch C:
Component Rotation - Top View
A
0
B
0
P
1
P
0
P
2
D
0
F
E
W
Center lines
of cavity
10 pitches cumulative
tolerance on tape
±
0.2 (
±
0.008)
Top
Tape
Cover
T
User Direction of Feed
T
1
Max. Cavity Size
See Note 1
Table 1
Bottom
Tape
Cover
G
2
R
Sketch A:
Bending Radius
See Note 2
Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
96
相關(guān)PDF資料
PDF描述
C0603C153C2PA CERAMIC CHIP CAPACITORS
C0603C153C2PC CERAMIC CHIP CAPACITORS
C0603C153C2RA CERAMIC CHIP CAPACITORS
C0603C153C2RC CERAMIC CHIP CAPACITORS
C0603C153C3GA CERAMIC CHIP CAPACITORS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
C0603C153F3GAC 功能描述:多層陶瓷電容器MLCC - SMD/SMT RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C0603C153F3GAC7867 功能描述:多層陶瓷電容器MLCC - SMD/SMT .015UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C0603C153F3GACTU 功能描述:多層陶瓷電容器MLCC - SMD/SMT 25volts 0.015uF 1% C0G RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C0603C153F3GAL 功能描述:多層陶瓷電容器MLCC - SMD/SMT .015UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel
C0603C153F3GEC7867 功能描述:CAP CER 0.015UF 25V C0G/NP0 0603 制造商:kemet 系列:C 包裝:帶卷(TR) 零件狀態(tài):在售 電容:0.015μF 容差:±1% 電壓 - 額定:25V 溫度系數(shù):C0G,NP0 工作溫度:-55°C ~ 125°C 特性:低 ESL 型 等級:AEC-Q200 應(yīng)用:汽車級,ESD 保護(hù) 故障率:- 安裝類型:表面貼裝,MLCC 封裝/外殼:0603(1608 公制) 大小/尺寸:0.063" 長 x 0.032" 寬(1.60mm x 0.80mm) 高度 - 安裝(最大值):- 厚度(最大值):0.034"(0.87mm) 引線間距:- 引線形式:- 標(biāo)準(zhǔn)包裝:4,000