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參數(shù)資料
| 型號： | C0402C109D2GAC |
| 廠商： | KEMET Corporation |
| 英文描述： | CERAMIC CHIP CAPACITORS |
| 中文描述： | 陶瓷芯片電容器 |
| 文件頁數(shù)： | 5/9頁 |
| 文件大?。?/td> | 1045K |
| 代理商： | C0402C109D2GAC |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape
fed
automatic
pick
and
place
systems. See page
7
8
for details on reeling quantities for commercial chips
and page
87
for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape
fed
automatic
pick
and
place
systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
8mm
±
.30
(.315
±
.012")
or
12mm
±
.30
(.472
±
.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
KEMET
X
C
G
Z
Y
Grid
placement
courtyard
"
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
Z
3.18
3.70
4.90
4.90
G
0.68
0.70
1.50
1.50
X
0.80
1.10
1.40
2.00
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
Wave Solder
Reflow Solder
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
0402
0603
0805
1206
1210
1812
1825
2220
2225
Dimension
Not Recommended
Not Recommended
#
$
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
93
P
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| C0402C109D2PAC | CERAMIC CHIP CAPACITORS |
| C0402C109D2RAC | CERAMIC CHIP CAPACITORS |
| C0402C109D2UAC | CERAMIC CHIP CAPACITORS |
| C0402C109D3GAC | CERAMIC CHIP CAPACITORS |
| C0402C109D3PAC | CERAMIC CHIP CAPACITORS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| C0402C109D2PAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
| C0402C109D2RAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
| C0402C109D2UAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
| C0402C109D3GAC | 功能描述:多層陶瓷電容器MLCC - SMD/SMT 1.00PF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 電容:10 pF 容差:1 % 電壓額定值:250 V 溫度系數(shù)/代碼:C0G (NP0) 外殼代碼 - in:0505 外殼代碼 - mm:1414 工作溫度范圍:- 55 C to + 125 C 產(chǎn)品:Low ESR MLCCs 封裝:Reel |
| C0402C109D3GAC TU | 制造商:KEMET Corporation 功能描述:CAP 1PF 25VDC C0G 0.5PF SMD 0402 - Tape and Reel |
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