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參數(shù)資料
| 型號： | C0201C758C3GAC |
| 廠商： | KEMET Corporation |
| 英文描述： | CERAMIC CHIP CAPACITORS |
| 中文描述： | 陶瓷芯片電容器 |
| 文件頁數(shù)： | 1/9頁 |
| 文件大?。?/td> | 1045K |
| 代理商： | C0201C758C3GAC |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
C
C 0805 C 103 K
5 R
A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF
J – ±5%
C – ±0.25pF
K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
P – (GMV) – special order only
G– ±2%
Z – +80%, -20%
DIMENSIONS—MILLIMETERS AND (INCHES)
CAPACITOR ORDERING INFORMATION
C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
10, 16, 25, 50, 100 and 200 Volts
Standard End Metalization: Tin-plate over nickel
barrier
Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
RoHS Compliant
FEATURES
CAPACITOR OUTLINE DRAWINGS
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1 - 100V
2 - 200V
5 - 50V
(14 digits - no spaces)
7 - 4V
3 - 25V
4 - 16V
8 - 10V
9 - 6.3V
W
L
T
B
S
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
ELECTRODES
* Part Number Example: C0805C103K5RAC
or
Solder
Reflow
METRIC
SIZE CODE
0603
1005
1608
2012
3216
3225
4532
4564
5650
5664
1608
EIA
SIZE CODE
0201*
0402*
0603
0805*
1206*
1210*
1812
1825*
2220
2225
(Standard Chips - For
Military see page
87
)
CODE
SIZE CODE
L - LENGTH
W - WIDTH
T
THICKNESS
B - BANDWIDTH
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
Solder Wave +
or
Solder Reflow
Solder Reflow
See page 7
8
for thickness
dimensions.
Solder Reflow
72
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| C0201C758C3PAC | CERAMIC CHIP CAPACITORS |
| C0201C758C3RAC | CERAMIC CHIP CAPACITORS |
| C0201C758C3UAC | CERAMIC CHIP CAPACITORS |
| C0201C758C4GAC | CERAMIC CHIP CAPACITORS |
| C0201C758C4PAC | CERAMIC CHIP CAPACITORS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| C0201C758C3PAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
| C0201C758C3RAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
| C0201C758C3UAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
| C0201C758C4GAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
| C0201C758C4PAC | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP CAPACITORS |
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