
Features 
l 
 Planar Die construction
l 
 200mW Power Dissipation
l 
 Zener Voltages from 2.4V - 39V
l 
 Ideally Suited for Automated Assembly Processes
Mechanical Data
l 
 Case:  SOD-323 Molded Plastic 
l 
 Terminals: Solderable per MIL-STD-202, Method 208
l 
 Approx. Weight: 0.008 gram
l 
 Mounting Position: Any 
l 
 Storage & Operating Junction Temperature:  -55
o
C to +150
o
C 
Maximum Ratings @ 25
o
C Unless Otherwise Specified 
Zener Current 
Maximum Forward 
Voltage 
Power Dissipation 
(Notes A)
Peak Forward Surge 
          I
FSM 
          2.0 
Current (Notes B)
I
F
V
F
       100
          mA
1.2 
V 
P
(AV)
200 
mWatt 
 Amps
NOTES:   
  BZT52C2V4S
THRU 
  BZT52C39S
200 mW 
Zener Diodes 
2.4 to 39 Volts
M C C
www.
mc c semi 
.c om
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or equivalent 
square wave, duty cycle = 4 pulses per minute maximum
.
INCHES 
MIN 
.090 
.068 
.045 
.027 
.009 
.002 
.012 
MM 
DIM 
MAX 
.107 
.078 
.054 
.038 
.014 
.006 
  --- 
MIN 
2.30 
1.75 
1.15 
0.70 
0.25 
0.05 
 0.30 
MAX 
2.70 
1.95 
1.35 
0.95 
0.35 
0.15 
  --- 
NOTE 
A 
B 
C 
D 
E 
F 
G 
SOD323
0.
031
”
0.0
59
"
0.0
39
”
SUGGESTED SOLDER
PAD LAYOUT
A
B
E
C
D
F
G
DIMENSIONS 
omp
onents
21201 Itasca Street Chatsworth
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