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參數(shù)資料
| 型號(hào)： | BX80524R300128 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, MICROPROCESSOR, XMA |
| 封裝： | SINGLE EDGE PROCESSOR PACKAGE |
| 文件頁(yè)數(shù)： | 16/130頁(yè) |
| 文件大?。?/td> | 2654K |
| 代理商： | BX80524R300128 |
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112
Datasheet
Intel Celeron Processor up to 1.10 GHz
6.1.1.1
Boxed Processor Heatsink Weight
The heatsink for the boxed Intel Celeron processor in the S.E.P. Package will not weigh more than
225 grams.
6.1.1.2
Boxed Processor Retention Mechanism
The boxed Intel Celeron processor requires a S.E.P. Package retention mechanism to secure the
processor in the 242-contact slot connector. A S.E.P. Package retention mechanism are provided
with the boxed processor. Motherboards designed for use by system integrators should include a
retention mechanism and appropriate installation instructions.
The boxed Intel Celeron processor does not require additional fan heatsink supports. Fan heatsink
supports are not shipped with the boxed Intel Celeron processor.
Motherboards designed for flexible use by system integrators must still recognize the boxed
Pentium II processor’s fan heatsink clearance requirements, which are described in the Pentium II
Processor at 233, 266, 300, and 333 MHz Datasheet (Order Number 243335).
Figure 33. Front View Space Requirements for the Boxed Processor in the S.E.P. Package
Table 57. Boxed Processor Fan Heatsink Spatial Dimensions for the S.E.P. Package
Fig. Ref.
Label
Dimensions (Inches)
Min
Typ
Max
A
Fan Heatsink Depth (see Figure 27)1.40
B
Fan Heatsink Height from Motherboard (see Figure 27)0.58
C
Fan Heatsink Height (see Figure 31)2.00
D
Fan Heatsink Width (see Figure 31)4.80
E
Fan Heatsink Base Width (see Figure 31)5.4
F
Airflow Keepout Zones from end of Fan Heatsink
G
Airflow Keepout Zones from face of Fan Heatsink
0.2
4.74 (D)
2.02 (C)
5.40 (E)
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