參數(shù)資料
型號： BUK625R0-40C
廠商： NXP SEMICONDUCTORS
元件分類： 功率晶體管
英文描述： N-channel TrenchMOS intermediate level FET
中文描述： 90 A, 40 V, 0.0083 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-252
封裝： PLASTIC, SC-63, DPAK-3
文件頁數(shù)： 6/14頁
文件大小： 193K
代理商： BUK625R0-40C
BUK625R0-40C
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 17 September 2010
6 of 14
NXP Semiconductors
BUK625R0-40C
N-channel TrenchMOS intermediate level FET
6.
Characteristics
Table 6.
Symbol
Static characteristics
V
(BR)DSS
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
drain-source
breakdown voltage
I
D
= 250 μA; V
GS
= 0 V; T
j
= 25 °C
I
D
= 250 μA; V
GS
= 0 V; T
j
= -55 °C
I
D
= 1 mA; V
DS
= V
GS
; T
j
= 25 °C;
see
Figure 9
; see
Figure 10
I
D
= 1 mA; V
DS
= V
GS
; T
j
= -55 °C;
see
Figure 9
I
D
= 1 mA; V
DS
= V
GS
; T
j
= 175 °C;
see
Figure 9
V
DS
= 40 V; V
GS
= 0 V; T
j
= 25 °C
V
DS
= 40 V; V
GS
= 0 V; T
j
= 175 °C
V
DS
= 0 V; V
GS
= 20 V; T
j
= 25 °C
V
DS
= 0 V; V
GS
= -20 V; T
j
= 25 °C
V
GS
= 10 V; I
D
= 25 A; T
j
= 25 °C;
see
Figure 11
V
GS
= 5 V; I
D
= 25 A; T
j
= 25 °C;
see
Figure 11
V
GS
= 4.5 V; I
D
= 25 A; T
j
= 25 °C;
see
Figure 11
V
GS
= 10 V; I
D
= 25 A; T
j
= 175 °C;
see
Figure 12
; see
Figure 11
40
36
1.8
-
-
2.3
-
-
2.8
V
V
V
V
GS(th)
gate-source threshold
voltage
-
-
3.3
V
0.8
-
-
V
I
DSS
drain leakage current
-
-
-
-
-
0.02
-
2
2
4.1
1
500
100
100
5
μA
μA
nA
nA
m
I
GSS
gate leakage current
R
DSon
drain-source on-state
resistance
-
5.5
6.9
m
-
6.2
8.3
m
-
-
10.1
m
Dynamic characteristics
Q
G(tot)
total gate charge
I
D
= 25 A; V
DS
= 32 V; V
GS
= 10 V;
see
Figure 13
; see
Figure 14
I
D
= 25 A; V
DS
= 32 V; V
GS
= 5 V;
see
Figure 13
; see
Figure 14
I
D
= 25 A; V
DS
= 32 V; V
GS
= 10 V;
see
Figure 13
; see
Figure 14
-
88
-
nC
-
50.5
-
nC
Q
GS
Q
GD
C
iss
C
oss
C
rss
gate-source charge
gate-drain charge
input capacitance
output capacitance
reverse transfer
capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain
inductance
internal source
inductance
-
-
-
-
-
14.6
25.9
3900
512
350
-
-
5200
614
480
nC
nC
pF
pF
pF
GS
= 0 V; V
DS
= 25 V; f = 1 MHz;
T
j
= 25 °C; see
Figure 15
t
d(on)
t
r
t
d(off)
t
f
L
D
V
DS
= 30 V; R
L
= 1.2
; V
GS
= 10 V;
R
G(ext)
= 10
-
-
-
-
-
23
52
164
77
3.5
-
-
-
-
-
ns
ns
ns
ns
nH
from upper edge of drain mounting base
to centre of die ; T
j
= 25 °C
from source lead to source bond pad ;
T
j
= 25 °C
L
S
-
7.5
-
nH
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