參數(shù)資料
型號(hào)： BUF11702PWP
文件頁(yè)數(shù)： 23/28頁(yè)
文件大小： 501K
代理商： BUF11702PWP
BUF11702
10+1-CHANNEL LCD GAMMA CORRECTION BUFFER
SLOS359B
–
MARCH 2001
–
REVISED OCTOBER 2001
23
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
1.
Prepare the PCB with a top side etch pattern as shown in Figure 52. There should be etching for the leads
as well as etch for the thermal pad.
2.
Place eighteen holes in the area of the thermal pad. These holes should be 13 mils in diameter. Keep them
small so that solder wicking through the holes is not a problem during reflow.
3.
Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. This helps
dissipate the heat generated by the BUF11702 IC. These additional vias may be larger than the
13-mil diameter vias directly under the thermal pad. They can be larger because they are not in the thermal
pad area to be soldered so that wicking is not a problem.
4.
Connect all holes to the internal ground plane.
5.
When connecting these holes to the ground plane, do not
use the typical web or spoke via connection
methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat
transfer during soldering operations. This makes the soldering of vias that have plane connections easier.
In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore,
the holes under the BUF11702 PowerPAD package should make their connection to the internal ground
plane with a complete connection around the entire circumference of the plated-through hole.
6.
The topside solder mask should leave the terminals of the package and the thermal pad area with its five
holes (dual) or nine holes (quad) exposed. The bottom-side solder mask should cover the five or nine holes
of the thermal pad area. This prevents solder from being pulled away from the thermal pad area during the
reflow process.
7.
Apply solder paste to the exposed thermal pad area and all of the IC terminals.
8.
With these preparatory steps in place, the BUF11702 IC is simply placed in position and run through the
solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
相關(guān)PDF資料
PDF描述
BUF11705 22 - V Supply, 10 + 1 Channel Gamma Correction Buffer
BUF11705AIPWPR 22 - V Supply, 10 + 1 Channel Gamma Correction Buffer
BUF12800 REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION
BUF12800AIPWP REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION
BUF12800AIPWPR REFERENCE VOLTAGE GENERATOR for LCD GAMMA CORRECTION
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BUF11702PWPG4 功能描述:LCD Gamma緩沖器 10+1 Ch Hi Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPR 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11702PWPRG4 功能描述:LCD Gamma緩沖器 10+1 Channel High Current Buffer RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF11704 制造商:BB 制造商全稱:BB 功能描述:18 - V SUPPLY MULTI - CHANNER GAMMA CORRECTION BUFFER
BUF11704AIPWP 功能描述:LCD Gamma緩沖器 18-V Supply Multi-Ch Correction RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*