參數(shù)資料
型號(hào)： BUF01900AIDRCR
廠商： TEXAS INSTRUMENTS INC
元件分類： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PDSO10
封裝： 3 X 3 MM, 0.90 MM HEIGHT, GREEN, PLASTIC, SON-10
文件頁(yè)數(shù)： 8/26頁(yè)
文件大小： 662K
代理商： BUF01900AIDRCR
BUF01900
BUF01901
SBOS337A OCTOBER 2006 REVISED OCTOBER 2006
www.ti.com
16
PROGRAMMABLE POWER SUPPLY
The BUF0190x integrated buffer amplifier can drive large
capacitive loads (see Typical Characteristics) and greater
than 100mA of output current, making it well-suited for pro-
grammable power supplies.
Note that the BUF01900 integrated buffer has an input
range that only extends to about 0.8V above GND; there-
fore, the programmable power supply is not able to output
voltages less than approximately 0.8V.
BUF01900
15V
+
100
F
Load
3.3V
10k
10k
C
(1)
NOTE: (1) Optional see Typical Characteristic curves
Figure 10 through Figure 14 for load regulation
performance.
Figure 24. Programmable Power Supply
QFN/DFN THERMALLY-ENHANCED
PACKAGE
The BUF0190x uses the 10-lead DFN package, a thin,
thermally-enhanced package designed to eliminate the
use of bulky heat sinks and slugs traditionally used in ther-
mal packages. The DFN package can be easily mounted
using standard printed circuit board (PCB) assembly tech-
niques. See QFN/SON PCB Attachment Application Note
(SLUA271) available at www.ti.com.
The thermal resistance junction to ambient (RqJA) of the
DFN package depends on the PCB layout. Using thermal
vias and wide PCB traces improves thermal resistance.
The thermal pad must be soldered to the PCB. The thermal
pad on the bottom of the package should be connected to
GND.
Soldering the exposed thermal pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests. Even
with applications that have low-power dissipation, the ex-
posed pad must be soldered to the PCB to provide struc-
tural integrity and long-term reliability.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BUF01900AIDRCRG4 功能描述:LCD Gamma緩沖器 Ref Vltg Gen for VCOM Adj RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF01900AIDRCT 功能描述:LCD Gamma緩沖器 Ref Vltg Gen for VCOM Adj RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF01900AIDRCTG4 功能描述:LCD Gamma緩沖器 Ref Vltg Gen for VCOM Adj RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF01900AIPW 功能描述:LCD Gamma緩沖器 Ref Vltg Gen for VCOM Adj RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
BUF01900AIPWG4 功能描述:LCD Gamma緩沖器 Ref Vltg Gen for VCOM Adj RoHS:否 制造商:Maxim Integrated 輸入補(bǔ)償電壓: 轉(zhuǎn)換速度: 電源電壓-最大:20 V 電源電壓-最小:9 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFN-38 封裝:Tube
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