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參數(shù)資料
| 型號(hào)： | BU52040HFV-TR |
| 廠商： | Rohm Semiconductor |
| 文件頁數(shù)： | 11/15頁 |
| 文件大小： | 465K |
| 描述： | IC HALL EFFECT BIPO LATCH HVSOF5 |
| 特色產(chǎn)品： | ROHM Hall Effect Sensor ICs |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 傳感范圍： | 5mT 跳閘，-5mT 釋放 |
| 類型： | 雙極卡鎖 |
| 電源電壓： | 1.65 V ~ 3.3 V |
| 電流 - 電源： | 300µA |
| 電流 - 輸出（最大）： | ±0.5mA |
| 輸出類型： | 數(shù)字，開路集電極 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | SOT-665 |
| 供應(yīng)商設(shè)備封裝： | 5-HVSOF |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | BU52040HFV-DKR BU52040HFV-DKR-ND BU52040HFVDKR |
BU52040HFV
Technical Note
11/12
www.rohm.com
2010.01 - Rev.B
?2010 ROHM Co., Ltd. All rights reserved.
?SPAN class="pst BU52040HFV-TR_2601631_6">Notes for use
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
6) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
7) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
8) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
9) Power source design
Since the IC performs intermittent operation, it has peak current when its ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
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