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參數(shù)資料
| 型號(hào)： | BTS737-S2 |
| 元件分類： | TVS-瞬態(tài)抑制二極管 |
| 英文描述： | Transient Voltage Suppressor Diodes |
| 中文描述： | ？4.75 - 41V。 4x35mΩ極限（可控硅）第21A示波器- 28？ |
| 文件頁(yè)數(shù)： | 3/14頁(yè) |
| 文件大小： | 248K |
| 代理商： | BTS737-S2 |
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BTS 736 L2
Semiconductor Group
Page 3
1999-Jul-20
Maximum Ratings
at T
j
= 25°C unless otherwise specified
Parameter
Symbol
Values
Unit
Supply voltage (overvoltage protection see page 4)
Supply voltage for full short circuit protection
T
j,start
=
-40 ...+150°C
Load current (Short-circuit current, see page 5)
Load dump protection
1
)
V
LoadDump
=
V
A
+
V
s
,
V
A
= 13.5 V
R
I
2
)
= 2
,
t
d
= 200
ms; IN
= low or high,
each channel loaded with
R
L
=
9.0
,
Operating temperature range
Storage temperature range
Power dissipation (DC)
4)
(all channels active)
Maximal switchable inductance, single pulse
V
bb
=
12V,
T
j,start
=
150°C
4)
,
I
L
=
4.0
A,
E
AS
=
296 mJ, 0
I
L
=
6.0
A,
E
AS
=
631 mJ, 0
see diagrams on page 9
Electrostatic discharge capability (ESD)
(Human Body Model)
out to all other pins shorted:
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
R=1.5k
; C=100pF
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagram page 8
V
bb
V
bb
43
24
V
V
I
L
V
Load
dump3
)
self-limited
A
V
60
T
j
T
stg
P
tot
-40 ...+150
-55 ...+150
°C
T
a
= 25°C:
T
a
= 85°C:
3.8
2.0
W
one channel:
two parallel channels:
Z
L
19.0
17.5
mH
IN:
ST:
V
ESD
1.0
4.0
8.0
kV
V
IN
I
IN
I
ST
-10 ... +16
V
±
2.0
±
5.0
mA
Thermal Characteristics
Parameter and Conditions
Symbol
Values
typ
Unit
min
Max
Thermal resistance
junction - soldering point
4),5)
junction - ambient
4)
each channel:
one channel active:
all channels active:
R
thjs
R
thja
--
--
--
--
12
--
--
K/W
40
33
1
)
Supply voltages higher than V
bb(AZ)
require an external current limit for the GND and status pins (a 150
resistor for the GND connection is recommended.
2)
R
I
= internal resistance of the load dump test pulse generator
3)
V
Load dump
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
4
)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70
μ
m thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 14
5
)
Soldering point: upper side of solder edge of device pin 15. See page 14
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