參數(shù)資料
型號(hào)： BTK1A
廠(chǎng)商： Lineage Power
英文描述： Dual Differential Transceivers(雙差分收發(fā)器)
中文描述： 雙差分收發(fā)器（雙差分收發(fā)器）
文件頁(yè)數(shù)： 17/18頁(yè)
文件大?。?/td> 362K
代理商： BTK1A
Lucent Technologies Inc.
17
Data Sheet
October 1998
BTK1A, BTL1A, and BTM1A
Dual Differential Transceivers
Power Dissipation
System designers incorporating Lucent data transmis-
sion drivers in their applications should be aware of
package and thermal information associated with these
components.
Proper thermal management is essential to the long-
term reliability of any plastic encapsulated integrated
circuit. Thermal management is especially important
for surface-mount devices, given the increasing circuit
pack density and resulting higher thermal density. A
key aspect of thermal management involves the junc-
tion temperature (silicon temperature) of the integrated
circuit.
Several factors contribute to the resulting junction tem-
perature of an integrated circuit:
I
Ambient use temperature
I
Device power dissipation
I
Component placement on the board
I
Thermal properties of the board
I
Thermal impedance of the package
Thermal impedance of the package is referred to as
Θ
ja
and is measured in °C rise in junction temperature
per watt of power dissipation. Thermal impedance is
also a function of airflow present in system application.
The following equation can be used to estimate the
junction temperature of any device:
T
j
= T
A
+
P
D
Θ
ja
where:
T
j
is device junction temperature (°C).
T
A
is ambient temperature (°C).
P
D
is power dissipation (W).
Θ
ja
is package thermal impedance (junction to
ambient
—
°C/W).
The power dissipation estimate is derived from two fac-
tors:
I
Internal device power
I
Power associated with output terminations
Multiplying I
CC
times V
CC
provides an estimate of inter-
nal power dissipation.
The power dissipated in the output is a function of the:
I
Termination scheme on the outputs
I
Termination resistors
I
Duty cycle of the output
Package thermal impedance depends on:
I
Airflow
I
Package type (e.g., DIP SOIC, SOIC/NB)
The junction temperature can be calculated using the
previous equation, after power dissipation levels and
package thermal impedances are known.
Figure 16 illustrates the thermal impedance estimates
for the various package types as a function of airflow.
This figure shows that package thermal impedance is
higher for the narrow-body SOIC package. Particular
attention should, therefore, be paid to the thermal man-
agement issues when using this package type.
In general, system designers should attempt to main-
tain junction temperature below 125 °C. The following
factors should be used to determine if specific data
transmission drivers in particular package types meet
the system reliability objectives:
I
System ambient temperature
I
Power dissipation
I
Package type
I
Airflow
12-2753F
Figure 16. Power Dissipation
DIP
SOIC/NB
J-LEAD SOIC/GULL WING
AIRFLOW (ft./min.)
200
400
600
800
1000
1200
0
40
50
60
70
80
90
100
110
120
130
140
T
Θ
j
(
°
C
相關(guān)PDF資料
PDF描述
BTL1A Dual Differential Transceivers(雙差分收發(fā)器)
BTM1A Dual Differential Transceivers(雙差分收發(fā)器)
BTR-3420AG 1310 nm TX / 1550 nm RX , 5V / 155 Mbps RoHS Compliant Single-Fiber Transceiver
BTR-3420A-SPG 1310 nm TX / 1550 nm RX , 5V / 155 Mbps RoHS Compliant Single-Fiber Transceiver
BTR-3420G 1310 nm TX / 1550 nm RX , 5V / 155 Mbps RoHS Compliant Single-Fiber Transceiver
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BTK1A16E 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:Transceiver
BTK1A16G 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:Transceiver
BTK1A16NB 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:Transceiver
BTK1A16P 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:Transceiver
BTK24-03S40 制造商:Bellnix Co Ltd 功能描述:Bulk
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*