參數(shù)資料
型號： BQ24003RGWTR
廠商： TEXAS INSTRUMENTS INC
元件分類： 電源管理
英文描述： 1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC20
封裝： 5 X 5 MM, PLASTIC, QFN-20
文件頁數(shù)： 12/31頁
文件大?。?/td> 1000K
代理商： BQ24003RGWTR
bq24001
bq24002
bq24003
SLUS462E SEPTEMBER 2000 REVISED NOVEMBER 2004
www.ti.com
2
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE
CHARGE STATUS
TJ
20-LEAD HTTSOP PowerPAD
(PWP)(1)
20-LEAD 5 mm
× 5 mm MLP
(RGW)(2)
CHARGE STATUS
CONFIGURATION
bq24001PWP
bq24001RGW
Single LED
40
°C to 125°C
bq24002PWP
bq24002RGW
2 LEDs
40 C to 125 C
bq24003PWP
bq24003RGW
Single bicolor LED
(1) The PWP package is available taped and reeled. Add R suffix to device type (e.g. bq24001PWPR) to order. Quantities 2500 devices per reel.
(2) The RGW package is available taped and reeled. Add R suffix to device type (e.g. bq24001RGWR) to order. Quantities 3000 devices per reel.
PACKAGE DISSIPATION RATINGS
PACKAGE
ΘJA
ΘJC
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
PWP(1)
30.88
°C/W
1.19
°C/W
3.238 W
0.0324W/
°C
RGW(2)
31.41
°C/W
1.25
°C/W
3.183 W
0.0318W/
°C
(1) This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (6.5 × 3.4 mm), internal 1 oz power and
ground planes, 8 thermal via underneath the die connecting to ground plane.
(2) This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (3.25 × 3.25 mm), internal 1 oz power
and ground planes, 9 thermal via underneath the die connecting to ground plane.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
bq24001
bq24002
bq24003
Supply voltage (Vcc with respect to GND)
13.5 V
Input voltage (IN, ISNS, EN, APG/THERM/CR/STAT1/STAT2, VSENSE, TMR SEL, VSEL) (all with respect to GND)
13.5 V
Output current (OUT pins)
2 A
Output sink/source current (STAT1 and STAT2)
10 mA
Operating free-air temperature range, TA
40
°C to 70°C
Storage temperature range, Tstg
65
°C to 150°C
Junction temperature range, TJ
40
°C to 125°C
Lead temperature (Soldering, 10 sec)
300
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
Supply voltage, VCC
4.5
10
V
Input voltage, VIN
4.5
10
V
Continuous output current
1.2
A
Operating junction temperature range, TJ
40
125
°C
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