參數(shù)資料
型號(hào): BM5446EFV-E2
廠商: Rohm Semiconductor
文件頁(yè)數(shù): 4/11頁(yè)
文件大?。?/td> 0K
描述: IC AMP SPEAKER W/DSP HTSSOP-B54
標(biāo)準(zhǔn)包裝: 1,500
類型: D 類
輸出類型: 2 通道(立體聲)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 10W x 2 @ 8 歐姆
電源電壓: 10 V ~ 26 V
特點(diǎn): 消除爆音,短路和熱保護(hù)
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: *
封裝/外殼: 54-VSSOP(0.295",7.50mm 寬)
包裝: *
Technical Note
2/32
BM5446EFV
www.rohm.com
2010.05 - Rev.B
2010 ROHM Co., Ltd. All rights reserved.
Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Conditions
Supply voltage
VCC
30
V
Pin 27, 30, 31, 51, 52
*1*2
Power dissipation
Pd
2.0
W
*3
4.5
W
*4
6.2
W
*5
Input voltage
VIN
-0.3 ~ 4.5
V
Pin 5 ~ 14, 22
*1
Open-drain terminal voltage
VERR
-0.3 ~ 30
V
Pin 26
*1
Operating temperature range
Topr
-25 ~ +85
Storage temperature range
Tstg
-55 ~ +150
Maximum junction temperature
Tjmax
+150
*1 The voltage that can be applied reference to GND (Pin 4, 36, 37, 45, 46) and VSS (Pin 15, 20).
*2 Do not, however exceed Pd and Tjmax=150℃.
*3 70mm×70mm×1.6mm, FR4, 1-layer glass epoxy board (Copper on bottom layer 0%)
Derating in done at 16mW/℃ for operating above Ta=25℃.
*4 70mm×70mm×1.6mm, FR4, 2-layer glass epoxy board (Copper on bottom layer 100%)
Derating in done at 36mW/℃ for operating above Ta=25℃. There are thermal via on the board.
*5 70mm×70mm×1.6mm, FR4, 4-layer glass epoxy board (Copper on bottom layer 100%)
Derating in done at 49.6mW/℃ for operating above Ta=25℃. There are thermal via on the board.
Operating conditions (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Conditions
Supply voltage
VCC
10 ~ 26
V
Pin 27, 30, 31, 51, 52
*1 *2
Minimum load impedance
(Speaker Output)
RL_SP
5.4
*6
Minimum load impedance
(DAC Output)
RL_DA
20
k
Pin 24, 25
*6 Do not, however exceed Pd.
* No radiation-proof design.
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