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  • 參數(shù)資料
    型號(hào): BM10B-ZESS-TBT
    廠商: J S T MFG CO LTD
    元件分類: 電路板相疊連接器
    英文描述: 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
    文件頁(yè)數(shù): 3/4頁(yè)
    文件大?。?/td> 200K
    代理商: BM10B-ZESS-TBT
    3
    ZE CONNECTOR
    Circuit No.1 mark
    2 to 5 circuits
    B
    2
    3
    4
    5
    6
    7
    8
    9
    10
    11
    12
    13
    14
    15
    16
    B03B-ZESK-D
    B04B-ZESK-D
    B05B-ZESK-D
    B06B-ZESK-D
    B07B-ZESK-D
    B08B-ZESK-D
    B09B-ZESK-D
    B10B-ZESK-D
    B11B-ZESK-D
    B12B-ZESK-D
    B13B-ZESK-D
    B14B-ZESK-D
    B15B-ZESK-D
    B16B-ZESK-D
    1.5
    3.0
    4.5
    6.0
    7.5
    9.0
    10.5
    12.0
    13.5
    15.0
    16.5
    18.0
    19.5
    21.0
    22.5
    6.0
    7.5
    9.0
    10.5
    12.0
    13.5
    15.0
    16.5
    18.0
    19.5
    21.0
    22.5
    24.0
    25.5
    27.0
    A
    B02B-ZESK-1D
    B03B-ZESK-1D
    B04B-ZESK-1D
    B05B-ZESK-1D
    B06B-ZESK-1D
    B07B-ZESK-1D
    B08B-ZESK-1D
    B09B-ZESK-1D
    B10B-ZESK-1D
    B11B-ZESK-1D
    B12B-ZESK-1D
    B13B-ZESK-1D
    B14B-ZESK-1D
    B15B-ZESK-1D
    B16B-ZESK-1D
    Circuits
    Without boss
    Dimensions (mm)
    Model No.
    With boss
    Material and Finish
    Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment)
    Wafer: Glass-filled PA 66, UL94V-0, natural
    Q’ty /
    box
    RoHS compliance This product displays (LF)(SN) on a label.
    Note: Top entry type 2 circuits is only header with boss.
    B
    2
    3
    4
    5
    6
    7
    8
    9
    10
    11
    12
    13
    14
    15
    16
    S02B-ZESK-2D
    S03B-ZESK-2D
    S04B-ZESK-2D
    S05B-ZESK-2D
    S06B-ZESK-2D
    S07B-ZESK-2D
    S08B-ZESK-2D
    S09B-ZESK-2D
    S10B-ZESK-2D
    S11B-ZESK-2D
    S12B-ZESK-2D
    S13B-ZESK-2D
    S14B-ZESK-2D
    S15B-ZESK-2D
    S16B-ZESK-2D
    1.5
    3.0
    4.5
    6.0
    7.5
    9.0
    10.5
    12.0
    13.5
    15.0
    16.5
    18.0
    19.5
    21.0
    22.5
    6.0
    7.5
    9.0
    10.5
    12.0
    13.5
    15.0
    16.5
    18.0
    19.5
    21.0
    22.5
    24.0
    25.5
    27.0
    A
    Circuits
    Q’ty /
    box
    Dimensions (mm)
    Model No.
    Material and Finish
    Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment)
    Wafer: Glass-filled PA 66, UL94V-0, natural
    RoHS compliance This product displays (LF)(SN) on a label.
    Top entry type
    Side entry type
    Circuit No.1 mark
    Top entry type
    Side entry type
    2 to 5 circuits
    6 to 9 circuits
    10 to 16 circuits
    Through-hole type shrouded header
    <For reference>
    As the color identification, the following alphabet shall be put in the underlined part.
    For availability, delivery and minimum order quantity, contact JST.
    ex.
    B02B-ZESK-1D, S02B-ZESK-2D
    S…natural Z…ivory E…blue K…black O…orange R…red Y…yellow M…green N…brown L…lemon yellow
    TR…tomato red MG…moss green DH…dark gray DO…dark orange LE…light blue PK…pink FY…vivid yellow DPK…dark pink
    相關(guān)PDF資料
    PDF描述
    BM11B-ZESS-TBT(LF)(SN) 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
    BM11B-ZESS-TBT 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
    BM12B-ZESS-TBT(LF)(SN) 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
    BM12B-ZESS-TBT 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
    BM13B-ZESS-TBT(LF)(SN) 13 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    BM10B-ZESS-TBT(LF)(SN) 制造商:JST Manufacturing 功能描述:CONN HEADER VERT SMD 10POS ZE 制造商:JST Manufacturing 功能描述:10 Position 1.5 mm Pitch SMT Shrouded Header
    BM10B-ZPDSS-TF(LF)(SN) 制造商:JST Manufacturing 功能描述:CONN HEADER SMD 10POS ZPD 制造商:JST Manufacturing 功能描述:10 Position 1.50 mm SMT Shrouded Header
    BM-10EG57ND 制造商:BRIGHT 制造商全稱:BRIGHT LED ELECTRONICS CORP 功能描述:hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
    BM-10EG58MD 制造商:BRIGHT 制造商全稱:BRIGHT LED ELECTRONICS CORP 功能描述:hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
    BM-10EG58ND 制造商:BRIGHT 制造商全稱:BRIGHT LED ELECTRONICS CORP 功能描述:LED DOT MATRIX DISPLAY