參數(shù)資料
型號: BL-XG0361-TR9
廠商: Bright LED Electronics Corp.
英文描述: AXIAL TYPE LED LAMPS SPECIFICATION
中文描述: 軸向型LED節(jié)能燈規(guī)格
文件頁數(shù): 5/6頁
文件大?。?/td> 203K
代理商: BL-XG0361-TR9
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
REVISION: 1.0
6
1.
Manual Of Soldering
The temperature of the iron tip should not be higher than 300
seconds per solder-land is to be observed.
Reflow Soldering
Preheating : 140
~160
℃±
5
,within 2 minutes.
Operation heating : 235
(MAX.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
SOLDERING:
(572
) and Soldering within 3
DIP soldering (Wave Soldering)
Preheating : 120
Operation heating : 245
Gradual Cooling (Avoid quenching).
~150
,within 120~180 sec.
℃±
5
within 5 sec.260
(Max)
2.
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
T
TIME
OVER 2 MIN.
4
/SEC. MAX.
4
/SEC. MAX.
10 SEC. MAX.
235
MAX.
140~160
T
TIME
120~180 sec.
Preheat
245
±5℃
within 5 sec.
Soldering heat Max. 260
120~150
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