參數(shù)資料
型號(hào): BL-XE1361-TR9
廠商: Bright LED Electronics Corp.
英文描述: SURFACE MOUNT CHIP LED LAMPS SPECIFICATION
中文描述: 表面貼裝芯片LED節(jié)能燈指明
文件頁(yè)數(shù): 6/6頁(yè)
文件大?。?/td> 260K
代理商: BL-XE1361-TR9
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
REVISION: 1.0
7
3.
Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
Storage:
4.
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1)
Temperature : 5
-30
(41
)Humidity : RH 60
(2)
After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a.
Completed within 24 hours.
b.
Stored at less than 30% RH.
(3)
Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4)
If baking is required, devices must be baked under below conditions:
12 hours at 60
℃±
3
.
Max.
5.
Package and Label of Products:
(1)
Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on
each bag.
(2)
Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x xx xx xx
Year Month Day
Manufacture Location
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