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參數(shù)資料
| 型號(hào)： | BL-HX136D-TRB |
| 廠商： | Bright LED Electronics Corp. |
| 英文描述： | Hi-Eff Green Suitable for all SMT assembly methods. |
| 中文描述： | 高效率Eff綠色適合所有SMT組裝方法。 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 280K |
| 代理商： | BL-HX136D-TRB |
B
B
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R
I
I
G
G
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H
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T
L
L
E
E
D
D
E
E
L
L
E
E
C
C
T
T
R
R
O
O
N
N
I
I
C
C
S
S
C
C
O
O
R
R
P
P
.
.
B
B
L
L
-
-
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H
X
X
1
1
3
3
6
6
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D
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T
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B
●
Soldering :
Ver.2.0 Page 6 of 7
SINCE 1981
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300
℃
(572
℉
) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140
℃
~160
℃
±5
℃
,within 2 minutes.
Operation heating : 235
℃
(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
3.
DIP soldering (Wave Soldering) :
Preheating : 120
℃
~150
℃
,within 120~180 sec.
Operation heating : 245
℃ ±
5
℃
within 5 sec.260
℃
(Max)
Gradual Cooling (Avoid quenching).
●
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook
.
T
Time
OVER 2 MIN.
4
℃
/SEC. MAX.
4
℃
/SEC. MAX.
10 SEC. MAX.
235
℃
MAX.
140~160
℃
T
Time
120~180 sec.
Preheat
245
±5℃
within 5 sec.
Soldering heat Max. 260
℃
120~150
℃
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