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參數(shù)資料
| 型號(hào)： | BL-HG636A-TRB |
| 廠(chǎng)商： | Bright LED Electronics Corp. |
| 英文描述： | Green Suitable for all SMT assembly methods. |
| 中文描述： | 綠色適合所有SMT組裝方法。 |
| 文件頁(yè)數(shù)： | 8/8頁(yè) |
| 文件大?。?/td> | 243K |
| 代理商： | BL-HG636A-TRB |
B
B
R
R
I
I
G
G
H
H
T
T
L
L
E
E
D
D
E
E
L
L
E
E
C
C
T
T
R
R
O
O
N
N
I
I
C
C
S
S
C
C
O
O
R
R
P
P
.
.
B
B
L
L
-
-
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G
G
6
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3
3
6
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A
A
-
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T
T
R
R
B
B
●
Notes for designing:
Ver.2.1 Page 7 of 7
SINCE 1981
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
Storage:
●
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5
℃
-30
℃
(41
℉
)Humidity : RH 60
﹪
Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 168 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
48 hours at 60
℃
±3
℃
.
●
Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x xx xx xx
Year Month Day
Manufacture Location
B
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BL-HG636D-TRB | SURFACE MOUNT CHIP LED LAMPS SPECIFICATION |
| BL-HGE33-TRB | Super Yellow Green Suitable for all SMT assembly methods. |
| BL-HGE33A-TRB | Super Yellow Green Suitable for all SMT assembly methods. |
| BL-HGE34A-TRB | SURFACE MOUNT CHIP LED LAMPS SPECIFICATION |
| BL-HGE34C-TRB | SURFACE MOUNT CHIP LED LAMPS SPECIFICATION |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BL-HG636D | 制造商:YSTONE 制造商全稱(chēng):Yellow Stone Corp 功能描述:SURFACE MOUNT CHIP LED LAMPS |
| BL-HG636D-TRB | 制造商:BRIGHT 制造商全稱(chēng):BRIGHT LED ELECTRONICS CORP 功能描述:SURFACE MOUNT CHIP LED LAMPS SPECIFICATION |
| BL-HG636G | 制造商:YSTONE 制造商全稱(chēng):Yellow Stone Corp 功能描述:SURFACE MOUNT CHIP LED LAMPS |
| BL-HG6J3B433G | 制造商:YSTONE 制造商全稱(chēng):Yellow Stone Corp 功能描述:SURFACE MOUNT TRI COLOR LED LAMPS |
| BL-HG6UBB433G | 制造商:YSTONE 制造商全稱(chēng):Yellow Stone Corp 功能描述:SURFACE MOUNT TRI COLOR LED LAMPS |
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