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參數(shù)資料
| 型號(hào)： | BL-HG0Y033B-TRB |
| 廠商： | Bright LED Electronics Corp. |
| 英文描述： | Yellow Green and Yellow Suitable for all SMT assembly methods. |
| 中文描述： | 黃綠色和黃色適用于所有的SMT組裝的方法。 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 258K |
| 代理商： | BL-HG0Y033B-TRB |
B
B
R
R
I
I
G
G
H
H
T
T
L
L
E
E
D
D
E
E
L
L
E
E
C
C
T
T
R
R
O
O
N
N
I
I
C
C
S
S
C
C
O
O
R
R
P
P
.
.
B
B
L
L
-
-
H
H
G
G
0
0
Y
Y
0
0
3
3
3
3
B
B
-
-
T
T
R
R
B
B
●
Soldering :
Ver.2.1 Page 6 of 7
SINCE 1981
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300
℃
(572
℉
) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140
℃
~160
℃
±5
℃
,within 2 minutes.
Operation heating : 260
℃
(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
3.
DIP soldering (Wave Soldering) :
Preheating : 120
℃
~150
℃
,within 120~180 sec.
Operation heating : 245
℃±
5
℃
within 5 sec.260
℃
(Max)
Gradual Cooling (Avoid quenching).
●
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook
.
T
Time
OVER 2 MIN.
4
℃
/SEC. MAX.
4
℃
/SEC. MAX.
10 SEC. MAX.
260
℃
MAX.
140~160
℃
T
Time
120~180 sec.
Preheat
245
±5℃
within 5 sec.
Soldering heat Max. 260
℃
120~150
℃
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BL-HG0Y033-TRB | 制造商:BRIGHT 制造商全稱:BRIGHT LED ELECTRONICS CORP 功能描述:Yellow Green and Yellow Suitable for all SMT assembly methods. |
| BL-HG336A | 制造商:YSTONE 制造商全稱:Yellow Stone Corp 功能描述:ULTRA CHIP LED LAMPS |
| BL-HG433 | 制造商:YSTONE 制造商全稱:Yellow Stone Corp 功能描述:SURFACE MOUNT CHIP LED LAMPS |
| BL-HG433A | 制造商:YSTONE 制造商全稱:Yellow Stone Corp 功能描述:SURFACE MOUNT CHIP LED LAMPS |
| BL-HG433A-TRB | 制造商:BRIGHT 制造商全稱:BRIGHT LED ELECTRONICS CORP 功能描述:Bluish Green Suitable for all SMT assembly methods. |
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