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參數(shù)資料
| 型號： | BH2219FVM-TR |
| 廠商： | Rohm Semiconductor |
| 文件頁數(shù)： | 7/10頁 |
| 文件大小： | 0K |
| 描述： | IC DAC 8BIT 2-CHAN MSOP8 |
| 標準包裝： | 1 |
| 設(shè)置時間： | 100µs |
| 位數(shù)： | 8 |
| 數(shù)據(jù)接口： | 串行 |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 電壓電源： | 單電源 |
| 工作溫度： | -20°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-VSSOP，8-MSOP（0.110"，2.80mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-MSOP |
| 包裝： | 標準包裝 |
| 輸出數(shù)目和類型： | 2 電壓，單極 |
| 采樣率（每秒）： | * |
| 其它名稱： | BH2219FVM-DKR BH2219FVM-DKR-ND BH2219FVMDKR |
BH2219FVM, BH2220FVM
Technical Note
6/7
www.rohm.com
2009.06 - Rev.A
2009 ROHM Co., Ltd. All rights reserved.
●
Notes for use
(1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
(2) Although we are confident in recommending the sample application circuits, carefully check their characteristics further
when using them. When modifying externally attached component constants before use, determine them so that they
have sufficient margins by taking into account variations in externally attached components and the Rohm LSI, not only
for static characteristics but also including transient characteristics.
(3) Absolute maximum ratings
Operating or testing the device over the maximum specifications may damage the part itself as well as peripheral components.
Therefore, please ensure that the specifications are not exceeded.
(4) GND potential
Ensure that the GND terminal is at the lowest potential under all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin regarding power dissipation (Pd) under actual operating conditions.
(6) Terminal shorts and mis-mounting
Incorrect orientation or misalignment of the IC when mounting to the PCB may damage part. Short-circuits caused by the
introduction of foreign matter between the output terminals or across the output and power supply or GND may also
result in destruction.
(7) Operation in a strong magnetic field
Operation in a strong electromagnetic field may cause malfunction.
(8) Reset circuit
The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons.
Therefore, set the time constant so as to satisfy the power source rise time.
●
Thermal Derating Curve
·
MSOP8
Board size: 70 x 70 x 1.6mm Material : FR4 glass epoxy board (copper foil area less than 3%)
Fig.18
0
100
200
300
400
500
0
25
50
75
100
125
Ta [℃]
PD
[mW]
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