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參數(shù)資料
| 型號： | BGY282 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 衰減器 |
| 英文描述： | dual band UHF amplifier module for GSM900 and GSM1800 |
| 中文描述： | 880 MHz - 915 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| 封裝： | CERAMIC, WITH PLASTIC CAP, SOT-632A, 12 PIN |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 386K |
| 代理商： | BGY282 |
2001 Dec 04
8
Philips Semiconductors
Preliminary specification
dual band UHF amplifier module for
GSM900 and GSM1800
BGY282
TOP VIEW
Fig.7 PCB test circuit.
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less or
equal to 210
°
C.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these
ovens. A double reflow process can be used.
Hand soldering is not recommended because of the
nature of the contacts.
The maximum allowed temperature is 250
°
C for a
maximum of 5 seconds.
The maximum ramp-up is 10
°
C per second.
The maximum cool-down is 5
°
C per second.
Fig.8 Recommended reflow temperature profile.
handbook, halfpage
0
200
100
0
1
5
2
3
4
MGM159
t (min)
T
(
°
C)
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