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參數(shù)資料
| 型號(hào)： | BD35632EFJ |
| 元件分類(lèi)： | 可調(diào)正電壓?jiǎn)温份敵鰳?biāo)準(zhǔn)穩(wěn)壓器 |
| 英文描述： | ADJUSTABLE POSITIVE REGULATOR, PDSO8 |
| 封裝： | HTSOP-8 |
| 文件頁(yè)數(shù)： | 4/5頁(yè) |
| 文件大?。?/td> | 93K |
| 代理商： | BD35632EFJ |
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REV. A
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NOTE FOR USE
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit.
If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3. Power supply lines
Please add a protection diode when a large inductance component is connected to the output terminal, and
reverse-polarity power is possible at startup or in output OFF condition.
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9. Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
TSD on temperature [°C] (typ.)
BD35632EFJ
175
10. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects
the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply
off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC
during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
Hysteresis temperature [°C] (typ.)
15
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