參數(shù)資料
型號: BCN162RBI1.5KF7
廠商: BI Technologies Corporation
英文描述: Thick Film Chip Resistor Arrays
中文描述: 厚膜晶片電阻陣列
文件頁數(shù): 8/10頁
文件大?。?/td> 138K
代理商: BCN162RBI1.5KF7
4-12
Model BCN Series
SOLDER PAD LAYOUT (Inch/mm)
.050
1.27
.032
0.80
.050
1.27
.087
2.20
.039
1.00
.084
2.10
.169
4.30
.118
3.00
.148
3.70
.022
0.57
.014
0.35
.014
0.35
.028
0.70
.018
0.45
.036
0.90
.041
1.05
.039
1.00
.032
0.80
.087
2.20
.039
1.00
.084
2.10
.154
3.90
.118
3.00
.148
3.70
.022
0.57
.014
0.35
.014
0.35
.028
0.70
.018
0.45
.036
0.90
.034
0.85
.039
1.00
.032
0.80
P
A
B
C
X
Y
A
B
C
X
Y
Wave Solder Process
Re-Flow Solder Process
BCN16 4A/AB/ABI
BCN 4D/4DBI
X
X
C
P
Y
Y
A
B
Model BCN 31 Only
Model BCN 4D, BCN 4DBI,
BCN 16 4AB & BCN 16 4ABI
BCN 31 8R/8S
.025
0.64
.048
1.20
.096
2.40
.012
0.30
.018
0.45
.024
0.60
.024
0.60
.048
1.20
.096
2.40
.012
0.30
.018
0.45
P
A
B
X
X1
Y
A
B
X
X1
Y
Wave Solder Process
Re-Flow Solder Process
BCN 16 8RB/8SB
X
1
X
P
Y
Y
A
X
1
X
X
B
Model BCN 16 8RB & BCN 16 8SB
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