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參數(shù)資料
| 型號： | B048K480T30 |
| 廠商： | Vicor Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | VI Chip - BCM Bus Converter Module |
| 中文描述： | 六芯片- BCM的總線轉換器模塊 |
| 文件頁數(shù)： | 1/15頁 |
| 文件大小： | 583K |
| 代理商： | B048K480T30 |
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B048K480T30
Rev. 1.5
Page 1 of 15
VI Chip Bus Converter Module
PRELIMINARY
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
+Out to -Out
-0.5 to 60.0
Vdc
Isolation voltage
2,250
Vdc
Input to Output
Output current
6.25
A
Continuous
Peak output current
9.4
A
For 1 ms
Output power
300
W
Continuous
Peak output power
450
W
For 1 ms
Case temperature
208
°C
During reflow
Operating junction temperature
(1)
-40 to 125
-55 to 125
°C
°C
T - Grade
M - Grade
Storage temperature
-40 to 150
-65 to 150
°C
°C
T - Grade
M - Grade
48 V to 48 V VI Chip Converter
300 Watt (450 Watt for 1 ms)
High density – 1218 W/in
3
Small footprint – 280 W/in
2
Low weight – 0.5 oz (14 g)
ZVS/ZCS isolated Sine
Amplitude Converter
Typical efficiency 96%
125°C operation
<1 μs transient response
3.5 million hours MTBF
No output filtering required
Surface mount BGA or J-Lead
packages
B048K480T30
Vin = 38 - 55 V
Vout = 38.0 - 55.0 V
Iout = 6.3 A
K = 1
Rout = 200.0 m
max
Actual size
VI Chip
Bus Converter Module
TM
– BCM
BCM
Output Power
Designator
(=P
OUT
/10)
B
048
K
480
T
30
Bus Converter
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade
Storage
T
-40 to150
M
-65 to150
Operating
-40 to125
-55 to125
Configuration Options
F = Onboard (Figure 20)
K = Inboard (Figure 19)
Output Voltage
Designator
(=V
OUT
x10)
Part Numbering
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Product Description
The VI Chip Bus Converter Module (BCM) is a high
efficiency (>96%), narrow input range Sine Amplitude
Converter (SAC) operating from a 38 to 55 Vdc primary
bus to deliver an isolated 38.0 V to 55.0 V secondary.
The BCM may be used to power non-isolated POL
converters or as an independent 38.0 – 55.0 V source.
Due to the fast response time and low noise of the
BCM, the need for limited life aluminum electrolytic or
tantalum capacitors at the load is reduced—or
eliminated—resulting in savings of board area, materials
and total system cost.
The BCM achieves a power density of 1218 W/in
3
and
may be surface mounted with a profile as low as 0.16"
(4 mm) over the PCB. Its VI Chip power package is
compatible with onboard or inboard surface mounting.
The VI Chip package provides flexible thermal
management through its low Junction-to-Case and
Junction-to-BGA thermal resistance. Owing to its high
conversion efficiency and safe operating temperature
range, the BCM does not require a discrete heat sink in
typical applications. Low junction to case and junction
to lead thermal impedances assure low junction
temperatures and long life in the harshest environments.
Absolute Maximum Ratings
相關PDF資料 |
PDF描述 |
|---|---|
| B048F480M30 | VI Chip - BCM Bus Converter Module |
| B048F480T30 | VI Chip - BCM Bus Converter Module |
| B0512BT1 | FEMALE HEADER PROFILE : 6.6mm STRAIGHT |
| B05 | FEMALE HEADER PROFILE : 6.6mm STRAIGHT |
| B0512BA1 | FEMALE HEADER PROFILE : 6.6mm STRAIGHT |
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