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參數(shù)資料
| 型號(hào)： | B048G120T15 |
| 廠商： | Vicor Corporation |
| 元件分類： | DC/DC變換器 |
| 英文描述： | VI Chip - BCM Bus Converter Module |
| 中文描述： | 六芯片- BCM的總線轉(zhuǎn)換器模塊 |
| 文件頁(yè)數(shù)： | 1/16頁(yè) |
| 文件大?。?/td> | 725K |
| 代理商： | B048G120T15 |
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Vicor Corporation
Tel: 800-735-6200
vicorpower.com
VI Chip Bus Converter
B048K120T10
Rev. 1.2
Page 1 of 16
4
5
is compatible with on-board or in-board
surface mounting. The VI Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGAthermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
4. B048L120T10 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Product Description
The VI Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a pre-regulated 48 Vdc primary bus
to deliver an isolated 12 V secondary for
Intermediate Bus Architecture
applications. The BCM may be used to
power non-isolated POL converters or as
an independent 12 V source. Due to the
fast response time and low noise of the
BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the
input of POL converters is reduced—or
eliminated—resulting in savings of board
area, materials and total system cost.
The BCM achieves a power density of
400 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its VI Chip power BGApackage
Absolute Maximum Ratings
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
TM to -In
-0.3 to 7.0
Vdc
SG to -In
500
mA
+Out to -Out
-0.5 to 15.0
Vdc
Isolation voltage
1500
Vdc
Input to Output
Operating junction temperature
-40 to 125
°C
See note 2
Output current
8.3
A
Continuous
Peak output current
12.5
A
For 1 ms
Case temperature during reflow
208
°C
Storage temperature
-40 to 150
°C
Output power
100
W
Continuous
Peak output power
150
W
For 1 ms
Thermal Resistance
Symbol
Parameter
Typ
Max
Units
R
θ
JC
Junction-to-case
1.1
1.5
°C/W
R
θ
JB
Junction-to-BGA
2.1
6.5
2.5
7.2
°C/W
R
θ
JA
Junction-to-ambient
3
°C/W
R
θ
JA
Junction-to-ambient
4
5.0
5.5
°C/W
48V to 12V VI Chip Converter
100 Watt (150 Watt for 1 ms)
High density – up to 400 W/in
3
Small footprint – 100 W/in
2
Low weight – 0.4 oz (12 g)
Pick & Place / SMD
>96% efficiency
125°C operation
<1 μs transient response
>3.5 million hours MTBF
No output filtering required
VI ChipBGA package
B048K120T10
1
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 8.3 A
K =
1
/
4
Rout = 32 m
max
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature.This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T10 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
Actual size
VI Chip
Bus Converter Module
TM
– BCM
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| B048L120T10 | VI Chip - BCM Bus Converter Module |
| B048L120T15 | VI Chip - BCM Bus Converter Module |
| B048K060M24 | VI Chip - BCM Mus Converter Module |
| B048K060T24 | VI Chip - BCM Mus Converter Module |
| B048F060M24 | VI Chip - BCM Mus Converter Module |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| B048K030M21 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:VI Chip - BCM Bus Converter Module |
| B048K030T21 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:VI Chip - BCM Bus Converter Module |
| B048K060M24 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:VI Chip - BCM Mus Converter Module |
| B048K060T24 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:VI Chip - BCM Mus Converter Module |
| B048K096M24 | 制造商:VICOR 制造商全稱:Vicor Corporation 功能描述:VI ChipTM - BCM Bus Converter Module |
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