參數(shù)資料
型號(hào): B048A120M20
廠商: Vicor Corporation
元件分類: DC/DC變換器
英文描述: VI Chip - BCM Bus Converter Module
中文描述: 六芯片- BCM的總線轉(zhuǎn)換器模塊
文件頁數(shù): 1/16頁
文件大小: 475K
代理商: B048A120M20
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
VI Chip Bus Converter
B048K120T20
Rev. 2.2
Page 1 of 16
4
5
Product Description
The VI Chip Bus Converter Module
(BCM) is a high efficiency (>96%),
narrow input range Voltage
Transformation Module (VTM) operating
from a 48 Vdc bus to deliver an isolated
12 V secondary for Intermediate Bus
Architecture applications. The BCM may
be used to power non-isolated POL
converters or as an independent 12 V
source. Due to the fast response time and
low noise of the BCM, the need for
limited life aluminum electrolytic or
tantalum capacitors at the input of POL
converters is reduced—or eliminated—
resulting in savings of board area,
materials and total system cost.
The BCM achieves a power density of
800 W/in
3
and may be surface mounted
with a profile as low as 0.16" (4mm) over
the PCB. Its VI Chip power package is
compatible with on-board or in-board
surface mounting. The VI Chip package
provides flexible thermal management
through its low Junction-to-Case and
Junction-to-BGAthermal resistance.
Owing to its high conversion efficiency
and safe operating temperature range, the
BCM does not require a discrete heat sink
in typical applications. It is also
compatible with heat sink options,
assuring low junction temperatures and
long life in the harshest environments.
Absolute Maximum Ratings
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
TM to -In
-0.3 to 7.0
Vdc
+Out to -Out
-0.5 to 15.0
Vdc
Isolation voltage
2250
Vdc
Input to Output
Operating junction temperature
-40 to 125
°C
T grade; See note 2
Output current
17.0
A
Continuous
Peak output current
25
A
For 1 ms
Case temperature during reflow
208
°C
Storage temperature
-40 to 150
°C
Output power
200
W
Continuous
Peak output power
300
W
For 1 ms
Thermal Resistance
Symbol
Parameter
Typ
Max
Units
R
θ
JC
Junction-to-case
1.1
1.5
°C/W
R
θ
JB
Junction-to-BGA
2.1
6.5
2.5
7.2
°C/W
R
θ
JA
Junction-to-ambient
3
°C/W
R
θ
JA
Junction-to-ambient
4
5.0
5.5
°C/W
48 V to 12 V VI Chip Converter
200 Watt (300 Watt for 1 ms)
High density – up to 800 W/in
3
Small footprint – 200 W/in
2
Low weight – 0.5 oz (14 g)
ZVS/ZCS isolated sine
amplitude converter
>96% efficiency
125°C operation
1 μs transient response
>3.5 million hours MTBF
No output filtering required
BGA or J-Lead packages
B048K120T20
1
+
VI
K
+
Vin = 42 - 53 V
Vout = 10.5 - 13.25 V
Iout = 17.0 A
K =
1
/
4
Rout = 25 m
max
Notes
1. For complete product matrix see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature.This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. B048L120T20 (0.25"H optional Pin Fins) surface mounted on FR4 board, 300 LFM.
Actual size
VI Chip
Bus Converter Module
TM
– BCM
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