參數(shù)資料
型號(hào): AXK7L70227J
元件分類: SMT連接器& FFC/FPC
英文描述: 70 CONTACT(S), FEMALE, FFC/FPC CONNECTOR, SOLDER, SOCKET
文件頁數(shù): 4/4頁
文件大?。?/td> 582K
代理商: AXK7L70227J
AXK7L, 8L
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the reten
t
ion
fittings and end terminals. Therefore,
please lift and remove from the side.
Doing so will also prevent cracking of
the soldered parts.
4
AKCT1B57E 200309-3YT
Please contact ..........
Specifications are subject to change without notice.
Printed in Japan.
Automation Controls Company
K
Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
K
Telephone: Japan (81) Osaka (06) 6908-1050
K
Facsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT 2003 All Rights Reserved
Matsushita Electric Works, Ltd.
These materials are printed on ECF pulp.
These materials are printed with earth-friendly vegetable-based (soybean oil) ink.
2. PC Boards and Recommended Metal
Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm. It is therefore necessary to make
sure that the right levels of solder are
used, in order to reduce solder bridge and
other issues. The figures to the right are
recommended metal mask patterns.
Please use them as a reference.
Socket
Recommended PC board pattern
(Mount pad arrangement pattern)
Recommended metal mask pattern
Metal mask thickness: 150
μ
m
(Terminal portion opening area ratio: 53%)
(Metal portion opening area ratio: 100%)
Recommended metal mask pattern
Metal mask thickness: 120
μ
m
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
Header
Recommended PC board pattern
(Mount pad arrangement pattern)
Relation between connector and mounting pad
Recommended metal mask pattern
Metal mask thickness: 150
μ
m
(Terminal portion opening area ratio: 52%)
(Metal portion opening area ratio: 40%)
Recommended metal mask pattern
Metal mask thickness: 120
μ
m
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 51%)
In particular, if a lot of solder is used in
the header retaining reten
t
ion fittings,
it might interfere with and cause
incomplete socket mating. Therefore,
please follow the recommended
conditions given on the left.
Pull
Pull
NG
D
±
0.05
3
±
0
B
±
0.05
0.40
±
0.03
4
±
0
0.23
±
0.03
5
±
0
1.00
±
0.03
C040
0.40
±
0.01
0.20
±
0.01
5
±
0
4
±
0
(
(
C040
1.00
±
0.01
3
±
0
1.40
±
0.01
5
±
0
5
±
0
0.20
±
0.01
0.40
±
0.01
4
±
0
(
1.00
±
0.01
3
±
0
(
1.40
±
0.01
5
±
0
C040
0.23
±
0.03
0.40
±
0.03
4
±
0
3
±
0
D
±
0.05
C
±
0.05
M
0.57
±
0.03
1
±
0
: Through hole without
(4.70
±
0.03)
(3.20
±
0.03)
(Max. 2.20)
Mounting pad
: Through hole without
0.20
±
0.01
0.40
±
0.01
3
±
0
(
4
±
0
1
±
0
0.25
±
0.01
1.30
±
0.01
0.40
±
0.01
0.20
±
0.01
3
±
0
(
4
±
0
1
±
0
1.30
±
0.01
0.31
±
0.01
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