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參數資料
| 型號： | AXK7L50227V |
| 元件分類： | SMT連接器& FFC/FPC |
| 英文描述： | 50 CONTACT(S), FEMALE, FFC/FPC CONNECTOR, SOLDER, SOCKET |
| 文件頁數： | 4/4頁 |
| 文件大小： | 582K |
| 代理商： | AXK7L50227V |
AXK7L, 8L
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the reten
t
ion
fittings and end terminals. Therefore,
please lift and remove from the side.
Doing so will also prevent cracking of
the soldered parts.
4
AKCT1B57E 200309-3YT
Please contact ..........
Specifications are subject to change without notice.
Printed in Japan.
Automation Controls Company
K
Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
K
Telephone: Japan (81) Osaka (06) 6908-1050
K
Facsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT 2003 All Rights Reserved
Matsushita Electric Works, Ltd.
These materials are printed on ECF pulp.
These materials are printed with earth-friendly vegetable-based (soybean oil) ink.
2. PC Boards and Recommended Metal
Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm. It is therefore necessary to make
sure that the right levels of solder are
used, in order to reduce solder bridge and
other issues. The figures to the right are
recommended metal mask patterns.
Please use them as a reference.
Socket
Recommended PC board pattern
(Mount pad arrangement pattern)
Recommended metal mask pattern
Metal mask thickness: 150
μ
m
(Terminal portion opening area ratio: 53%)
(Metal portion opening area ratio: 100%)
Recommended metal mask pattern
Metal mask thickness: 120
μ
m
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
Header
Recommended PC board pattern
(Mount pad arrangement pattern)
Relation between connector and mounting pad
Recommended metal mask pattern
Metal mask thickness: 150
μ
m
(Terminal portion opening area ratio: 52%)
(Metal portion opening area ratio: 40%)
Recommended metal mask pattern
Metal mask thickness: 120
μ
m
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 51%)
In particular, if a lot of solder is used in
the header retaining reten
t
ion fittings,
it might interfere with and cause
incomplete socket mating. Therefore,
please follow the recommended
conditions given on the left.
Pull
Pull
NG
D
±
0.05
3
±
0
B
±
0.05
0.40
±
0.03
4
±
0
0.23
±
0.03
5
±
0
1.00
±
0.03
C040
0.40
±
0.01
0.20
±
0.01
5
±
0
4
±
0
(
(
C040
1.00
±
0.01
3
±
0
1.40
±
0.01
5
±
0
5
±
0
0.20
±
0.01
0.40
±
0.01
4
±
0
(
1.00
±
0.01
3
±
0
(
1.40
±
0.01
5
±
0
C040
0.23
±
0.03
0.40
±
0.03
4
±
0
3
±
0
D
±
0.05
C
±
0.05
M
0.57
±
0.03
1
±
0
: Through hole without
(4.70
±
0.03)
(3.20
±
0.03)
(Max. 2.20)
Mounting pad
: Through hole without
0.20
±
0.01
0.40
±
0.01
3
±
0
(
4
±
0
1
±
0
0.25
±
0.01
1.30
±
0.01
0.40
±
0.01
0.20
±
0.01
3
±
0
(
4
±
0
1
±
0
1.30
±
0.01
0.31
±
0.01
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| AXK7L54217G | 功能描述:FFC & FPC連接器 Conn B-B SKT 54 POS 0.4mm RoHS:否 制造商:JAE Electronics 產品類型:Plugs 系列:HD 節(jié)距:0.5 mm 位置/觸點數量:40 安裝角: 安裝風格:Cable 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:100 V per contact 電流額定值:0.24 A to 1 A |
| AXK7L54217J | 功能描述:板對板與夾層連接器 Use AXK7L54217G RoHS:否 制造商:JAE Electronics 系列:WP3 產品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數量:50 排數:2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| AXK7L54217V | 功能描述:板對板與夾層連接器 Use AXK7L54217G RoHS:否 制造商:JAE Electronics 系列:WP3 產品類型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點數量:50 排數:2 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A |
| AXK7L54223G | 功能描述:FFC & FPC連接器 CONN SOCKET FPC .4MM 54POS SMD RoHS:否 制造商:JAE Electronics 產品類型:Plugs 系列:HD 節(jié)距:0.5 mm 位置/觸點數量:40 安裝角: 安裝風格:Cable 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:100 V per contact 電流額定值:0.24 A to 1 A |
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