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參數(shù)資料
| 型號： | ATJ2085 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | ATJ2085 is a single-chip for flash-based digital music player |
| 中文描述： | ATJ2085是一種單芯片基于閃存的數(shù)字音樂播放器 |
| 文件頁數(shù)： | 32/35頁 |
| 文件大?。?/td> | 609K |
| 代理商： | ATJ2085 |
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ATJ2085 DATA SHEET Actions
Copyright 2004 Actions Semiconductor Co., Ltd. All rights reserved.
VER 1.5
Page 31
8/18/2004
7. Recommended Soldering Conditions
7.1 Soldering Conditions
Soldering Conditions for Surface-Mount Devices
Soldering Process Soldering Conditions
Peak package’s surface temperature: 235
Reflow time: 30 seconds or less (210
or more)
Maximum allowable number of reflow processes: 2
Infrared ray reflow
Exposure limit: 3 days (10 hours of pre-baking is required at 125
afterward).
Terminal temperature: 300
or less
Partial heating method
Heat time: 3 seconds or less (for one side of a device)
Note: Maximum number of days during which the product can be stored at the temperature of 25
and
relative humidity of 65% or less after dry-pack package is opened.
Caution: Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
7.2 Precaution against ESD for Semiconductors
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must
be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators
that easily build static electricity. Semiconductor devices must be stored and transported in an
anti-static container, static shielding bag or conductive material. All test and measurement tools
including work bench and floor should be grounded. The operator should be grounded using wrist
strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be
taken for PW boards with semiconductor devices on it.
7.3 Handling of Unused Input Pins for CMOS
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to
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