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參數(shù)資料
| 型號： | ATJ2001P176 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | ATJ2001 PDA + MP3 Decoder |
| 中文描述： | ATJ2001掌上電腦MP3解碼 |
| 文件頁數(shù)： | 23/25頁 |
| 文件大小： | 893K |
| 代理商： | ATJ2001P176 |
Actions Semiconductor Co.,LTD
24.576MHz
ATJ2001 PDA+MP3 Decoder
23 Tel 86-756-3392353 Fax 86-756-3392251
/1
/2
/4
/8
/16
/32
/64
/128
/256
/512
/1024
8.5mA
4.7mA
2.9mA
1.8mA
1.4mA
1.1mA
0.96mA
0.88mA
0.85mA
0.84mA
0.83mA
2.) DSP Dissipation (Vbat=3.0V,MCU in Debug mode)
DSP Speed (MIPS)
Ivdd (Max)
6
12
24
36
48
60
11.7mA
18.8mA
30.7mA
43.2mA
55.9mA
67.2mA
F
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
ATJ2001
.
Table 4-1. Soldering Conditions for Surface-Mount Devices
Soldering Process
Soldering Conditions
Peak package’s surface temperature: 235
°
C
Reflow time: 30 seconds or less (210
°
C or more)
Maximum allowable number of reflow processes: 2
Infrared ray reflow
Exposure limit: 3 days
Note
(10 hours of pre-baking is required at 125
°
C afterward).
Terminal temperature: 300
°
C or less
Partial heating method
Heat time: 3 seconds or less (for one side of a device)
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a
relative humidity of 65% or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial
heating method for terminal sections).
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
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