參數(shù)資料
型號(hào): AT32UC3A0128-ALUT
廠商: Atmel
文件頁(yè)數(shù): 61/97頁(yè)
文件大小: 0K
描述: IC MCU AVR32 128KB FLASH 144LQFP
產(chǎn)品培訓(xùn)模塊: AVR UC3 Audio Application
MCU Product Line Introduction
AVR EVK1105 Digital Audio Gateway Kit
AVR® UC3 Introduction
標(biāo)準(zhǔn)包裝: 300
系列: AVR®32 UC3 A0
核心處理器: AVR
芯體尺寸: 32-位
速度: 66MHz
連通性: EBI/EMI,以太網(wǎng),I²C,SPI,SSC,UART/USART,USB OTG
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 109
程序存儲(chǔ)器容量: 128KB(128K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 32K x 8
電壓 - 電源 (Vcc/Vdd): 1.65 V ~ 1.95 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 144-LQFP
包裝: 托盤
配用: ATSTK600-RC33-ND - STK600 ROUTING CARD AVR
ATEVK1105-ND - KIT EVAL FOR AT32UC3A0
ATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMR
ATEVK1100-ND - KIT DEV/EVAL FOR AVR32 AT32UC3A
64
AT32UC3A
13. Mechanical Characteristics
13.1
Thermal Considerations
13.1.1
Thermal Data
Table 13-1 summarizes the thermal resistance data depending on the package.
13.1.2
Junction Temperature
The average chip-junction temperature, T
J, in °C can be obtained from the following:
1.
2.
where:
θ
JA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 13-1 on page
θ
JC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
θ
HEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet.
P
D = device power consumption (W) estimated from data provided in the section ”Power
T
A = ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
J in °C.
Table 13-1.
Thermal Resistance Data
Symbol
Parameter
Condition
Package
Typ
Unit
θ
JA
Junction-to-ambient thermal resistance
Still Air
TQFP100
43.4
C/W
θ
JC
Junction-to-case thermal resistance
TQFP100
5.5
θ
JA
Junction-to-ambient thermal resistance
Still Air
LQFP144
39.8
C/W
θ
JC
Junction-to-case thermal resistance
LQFP144
8.9
T
J
T
A
P
D
θ
JA
×
()
+
=
T
J
T
A
P
(
D
θ
(
HEATSINK
×θ
JC ))
++
=
32058KS–AVR32–01/12
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