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參數(shù)資料
| 型號： | AT17LV65-10SI |
| 廠商： | Atmel |
| 文件頁數(shù)： | 13/26頁 |
| 文件大小： | 0K |
| 描述： | IC SRL CONFIG EEPROM 64K 20SOIC |
| 標準包裝： | 38 |
| 可編程類型： | 串行 EEPROM |
| 存儲容量： | 64kb |
| 電源電壓： | 3 V ~ 3.6 V，4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 20-SOIC（0.295"，7.50mm 寬） |
| 供應商設(shè)備封裝： | 20-SOIC W |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 609 (CN2011-ZH PDF) |
| 配用： | ATDH2225-ND - CABLE ISP FOR AT17 ATDH2200E-ND - CONFIGURATOR PROGRAM BOARD KIT |
| 其它名稱： | AT17LV6510SI |
20
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
23.2
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A
0.210
2
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
3
D1
0.005
3
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
e
0.100 BSC
eA
0.300 BSC
4
L
0.115
0.130
0.150
2
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